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Circuit board and shell seamless glue injection equipment and method

A technology for circuit boards and shells, which is applied in the field of seamless glue injection equipment for circuit boards and shells, can solve the problems of high cost, large floor space, and large volume of glue dispensers. Back overflow glue, high production efficiency effect

Inactive Publication Date: 2018-03-09
台州市吉吉知识产权运营有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the automatic dispensing machine integrates the functions of dispensing, drying and flipping, this kind of dispensing machine can only be used for gluing between relatively simple parts. For some complex gluing, such as circuit boards and The dispensing process between shells requires multiple dispensing steps, and inspections cannot be performed at any time during the dispensing process to judge the dispensing quality
In addition, some workers will fully upgrade the automatic dispensing machine to meet the needs of multiple dispensing. At that time, this will cause the cost of the dispensing machine to be too high, and the improved and upgraded dispensing machine is bulky and occupies an area. large area

Method used

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  • Circuit board and shell seamless glue injection equipment and method
  • Circuit board and shell seamless glue injection equipment and method
  • Circuit board and shell seamless glue injection equipment and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] like figure 1 As shown, a circuit board and shell seamless glue injection equipment includes a placement fixture 2, a dispensing frame 1 that provides support for the placement fixture 2, and a dispensing head 3;

[0038] The placement jig 2 is used to support the combined circuit board and shell;

[0039] The dispensing head 3 is arranged above the placing jig 2 for dispensing the circuit board and the shell;

[0040] It also includes a controller, the controller is connected to the dispensing head 3, and controls the corresponding dispensing head 3 to perform the dispensing action according to the dispensing position and the parameters of the coding equipment input by the user;

[0041] Preferably, it also includes a sealing inspection device 4 arranged above the placing jig 2 . The above referred to in this embodiment is not limited to directly above.

[0042] After the dispensing is completed, the sealing inspection is an indispensable process. The sealing of the...

Embodiment 2

[0059] like figure 2 As shown, a method for seamless glue injection between the circuit board and the shell, the following steps are performed:

[0060] Step 1, put the circuit board and the shell into the dispensing area of ​​the fixture;

[0061] In this step, the infrared sensor can be used to determine whether the circuit board and the casing are accurately placed in the dispensing area. If not, it will affect the starting position and end position of dispensing, resulting in a lack of product quality. In addition , The infrared sensor is simple, direct and effective, and it is a common product on the market with a low price.

[0062] Step 2, specify the dispensing position and the parameter setting of the inkjet equipment;

[0063] In this embodiment, editing the preset program is embodied in specifying the dispensing position and the parameter setting of the inkjet equipment, selecting the corresponding dispensing head, and moving to the program setting position for d...

Embodiment 3

[0078] In step 4.2, when the detected tightness is poor, re-dispensing step 5 is performed.

[0079] The glue dispensing step 5 can again dispens glue to the circuit board and the shell, and convert the secondary products into qualified products.

[0080] Preferably, the re-dispensing step 5 specifically includes:

[0081] Step 5.1, put the circuit board and the shell into the dispensing area of ​​the fixture again;

[0082] Step 5.2, infrared scanning and acquisition of defect starting position and defect length;

[0083] Step 5.3, manually adjust the dispensing head, and move the dispensing head to the starting position of the defect;

[0084] Step 5.4, setting the dispensing end point position according to the defect length;

[0085] Step 5.5, start the program to dispense again.

[0086] All the other are with embodiment 2.

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Abstract

The invention discloses circuit board and shell seamless glue injection equipment. The circuit board and shell seamless glue injection equipment comprises a placement jig, a dispensing rack for supporting the placement jig, a dispensing head and a controller, wherein the placement jig is used for supporting combined circuit board and shell; the dispensing head is arranged above the placement jig and is used for dispensing of a circuit board and a shell; and the controller is connected with the dispensing head and is used for controlling the corresponding dispensing head to do dispensing actionaccording to dispensing positions and code spraying equipment parameters, which are input by a user. The invention further discloses a circuit board and shell seamless glue injection method. The circuit board and shell seamless glue injection method comprises the following steps: step 1, putting the circuit board and the shell into a dispensing region of the placement jig; step 2, appointing thedispensing positions and setting the code spraying equipment parameters; and step 3, operating a procedure for carrying out dispensing. The equipment disclosed by the invention is simple in structure,convenient to operate, high in production efficiency and low in labor cost and the problem that glue is overflowed after glue injection is effectively solved. The circuit board and shell seamless glue injection equipment is high in production efficiency and low in labor cost and the problem that glue is overflowed after glue injection is effectively solved.

Description

technical field [0001] The invention relates to a seamless glue injection device and method for a circuit board and a casing. Background technique [0002] In the electronics industry, product performance is the focus of every research and development, but as a manufacturing industry, efficiency and quality are the center of value creation in manufacturing. At present, with the development of science and technology, electronics are becoming more and more sophisticated. The requirements are getting higher and higher, and automation is the core of human resources in Industry 4.0, but the current products are improving with the industry's capabilities; labor cost is a problem that every company must consider; how to use the least manpower to create the greatest income is every company Things that companies are paying attention to. [0003] During production, the glue injection between the circuit board and the shell is an important process, and the quality of the glue injectio...

Claims

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Application Information

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IPC IPC(8): B05C5/02B05C11/10B05C13/02G01M3/20G01M3/38
CPCB05C5/0212B05C11/1002B05C13/02G01M3/20G01M3/38
Inventor 季玮玮
Owner 台州市吉吉知识产权运营有限公司
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