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Test module for compression type IGBT device power cycle test

A technology for testing modules and power cycles, which is applied in the direction of single semiconductor device testing, instruments, and electrical measurement. It can solve the problems of low cooling efficiency and achieve the effects of ensuring stability, preventing insufficient cooling capacity, and ensuring connection stability.

Inactive Publication Date: 2018-03-09
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defect in the prior art that the cooling efficiency is not high when testing multiple crimped IGBTs

Method used

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  • Test module for compression type IGBT device power cycle test
  • Test module for compression type IGBT device power cycle test
  • Test module for compression type IGBT device power cycle test

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Embodiment 1

[0039] The present embodiment provides a test module for the power cycle test of the crimping type IGBT device, comprising: a test assembly 1, the test assembly 1 includes a plurality of sets of devices to be tested 2 arranged in parallel with each other; the circulating water system is provided with multiple A set of cooling water assemblies respectively connected to each of the devices under test 2 , and each group of the cooling water channels respectively cools the devices under test 2 connected thereto.

[0040] In the prior art, the water circuit used for cooling of the test platform is arranged in series, and the cooling water flows through multiple IGBT devices to be tested one after another. When the cooling water flows through the IGBT devices located at the rear, the water temperature is already very high. The cooling capacity plummeted.

[0041] In the test module provided in this embodiment, multiple devices under test 2 are arranged in parallel, and each device u...

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Abstract

The invention provides a test module for the compression type IGBT device power cycle test. The test module comprises a test assembly and a circulating water system. The test assembly comprises a plurality of groups of to-be-tested devices which are arranged in parallel. A plurality of groups of cooling water assemblies which are respectively connected with the to-be-tested devices are arranged onthe circulating water system. Each group of cooling water channels is used for cooling the to-be-tested devices connected with the cooling water channels. The plurality of to-be-tested devices are arranged in parallel. Each to-be-tested device is connected with an independent cooling water assembly. The cooling processes of the to-be-tested device do not interfere with one another. Therefore, theproblem that the cooling capacity is insufficient due to the fact that the cooling water of the plurality of to-be-tested devices are arranged in series in the prior art is effectively solved. The test efficiency can be effectively improved.

Description

technical field [0001] The invention relates to the technical field of crimping IGBT devices, in particular to a test module for power cycle tests of crimping IGBT devices. Background technique [0002] The water cooling system and test fixtures in the currently applied power cycle test platform are mainly designed for soldered IGBT devices. The soldered IGBT devices have one-sided heat dissipation, and the installation and wiring are simple. [0003] Compared with solder-type devices, press-fit IGBT devices have high power consumption, large volume, and high requirements for installation and crimping. Therefore, when multiple press-fit IGBT devices are tested on a power cycle test platform, there are the following problems: The original test platform The water circuit for cooling is arranged in series, and the cooling water flows through multiple IGBT devices to be tested one by one. When the cooling water flows through the IGBT devices located at the rear, the water temper...

Claims

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Application Information

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IPC IPC(8): G01R31/26
CPCG01R31/2619
Inventor 张雷李金元潘艳崔梅婷
Owner GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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