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cutting device

A cutting device, cutting tool technology, applied in the direction of fine working device, cleaning method using liquid, cleaning method and utensils, etc., can solve problems such as false detection, optical sensor pollution, etc.

Active Publication Date: 2021-06-11
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, in the mechanism disclosed in Patent Document 2, when a large amount of cutting chips is contained in the gas in the processing chamber, there is still a small gap in which the opening and closing cover remains, which may cause contamination of the optical sensor and cause erroneous detection. possibility of

Method used

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Embodiment Construction

[0025] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. refer to figure 1 , is a perspective view of a cutting device 2 having a non-contact setting mechanism (tool end detection mechanism) according to an embodiment of the present invention.

[0026] 4 is a base of the cutting device 2, and the chuck table 6 is arranged on the base 4, and the chuck table 6 is rotatable and can reciprocate in the X-axis direction by a machining feed member not shown. A waterproof cover 8 is disposed around the chuck table 6 , and a bellows 10 for protecting the shaft of the machining feed mechanism is connected between the waterproof cover 8 and the base 4 .

[0027] A door-shaped post 12 is erected behind the base 4 . A pair of guide rails 14 extending in the Y-axis direction are fixed to the column 12 . A Y-axis moving block 16 is mounted on the column 12, and the Y-axis moving block 16 can move along the guide rail 14 by a Y-ax...

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Abstract

A cutting device is provided having a non-contact setting mechanism. The cutting device has: a chuck table that holds a workpiece; a cutting unit that cuts the workpiece with a cutting tool; a detection member that detects the position of the tip of the cutting tool; and a control member that controls the chuck table, the cutting unit, and the The detection component is controlled, and the detection component includes: a tool intrusion part; a light emitting part arranged on one side of the tool intrusion part; a light receiving part arranged on the other side of the tool intrusion part, which receives light from the light emitting part; washing water Nozzles for supplying cleaning water to the end surfaces of the light-emitting part and light-receiving part to prevent chips from adhering to the end surfaces; and air supply nozzles for supplying air to the end surfaces, and the control member stops cleaning from The water supply nozzle and the air supply nozzle supply cleaning water and air, and intermittently supply cleaning water and air to the end surface to remove chips adhering to the end surface during standby other than the detection operation.

Description

technical field [0001] The present invention relates to a cutting device, and more particularly, to a cutting device capable of preventing contamination of the optical sensor while suppressing supply of washing water to an optical sensor of a non-contact installation mechanism. Background technique [0002] Various electronic components requiring precise cutting such as semiconductor wafers, ceramics, and glass are divided into individual chips by using a cutting device called a dicing machine. In the processing of these electronic components, precise dicing in the order of microns is required, and not only the size of the chip but also the depth of incision is important for this dicing. [0003] For example, the semiconductor wafer is fixed on the dicing tape, and the cutting tool is cut into the dicing tape by about 10 to 30 μm to completely cut the semiconductor wafer. However, if the cutting amount for the dicing tape is insufficient, the wafer cannot be completely cut. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D7/04B28D7/00B28D7/02B08B3/02B08B5/02
CPCB08B3/02B08B5/02B28D5/0058B28D5/0076B28D5/0082B28D7/00B28D7/02B28D7/04Y02P70/10H01L21/67092H01L21/67259H01L21/67051B28D5/0041B28D5/0023
Inventor 笠井刚史
Owner DISCO CORP