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Surface treating method of copper or copper ally

A technology of surface treatment and surface treatment agent, applied in the field of surface treatment of copper or copper alloys, can solve the problems of poor replacement of air and surface treatment agent, difficulty, difficulty in forming an anti-rust film on copper pads, etc. The effect of usage

Inactive Publication Date: 2008-12-31
MEC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the case of a substrate having a diameter of 400 μm or less in the opening of the solder resist layer in the copper pad portion, such as a substrate for packaging, the solder resist layer is usually applied to a thickness of 20 to 35 μm. Therefore, the ratio of the coating thickness of the solder resist layer to the opening diameter of the solder resist layer (coating thickness / opening diameter) becomes larger
As a result, there are problems in that the replacement of air and the surface treatment agent is poor, the surface treatment agent does not penetrate into the copper pad well in the dipping and conveying device, and the antirust film cannot be formed.
Furthermore, it is difficult to uniformly form an anti-corrosion film in such a small-diameter copper pad as described above even with a normal sprayer.
In addition, in the same way, it is difficult to form an anti-corrosion film on small parts such as through holes and via holes, and it will be difficult to use immersion treatment.

Method used

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  • Surface treating method of copper or copper ally
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  • Surface treating method of copper or copper ally

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037]Example 1 uses a two-fluid spray treater. The two-fluid spray treatment machine includes an air compressor part, a copper surface treatment agent storage part and a spray treatment part, and each part is connected by piping. According to the principle of mist blowing, the copper surface treatment agent is sucked from the copper surface treatment agent storage part by the compressed air from the air compressor part, and the air and the copper surface treatment agent are mixed and sprayed in the two-fluid nozzle.

[0038] When the substrate is conveyed by the conveying device, nozzles are provided above and below the conveying surface in order to simultaneously process the upper surface and the lower surface of the substrate. The position of the nozzle was set at a position 10 cm away from the conveyance surface. As the two-fluid nozzle, BIMV8002S (trade name, two-fluid nozzle manufactured by Ikeuchi Co., Ltd.) was used.

[0039] As a surface treatment agent, MECSEAL CL-...

Embodiment 2

[0041] Example 2 was processed in the same manner as in Example 1 except that the spraying time was set to 5 seconds.

Embodiment 3

[0043] In Example 3, in the same spray processor as in Example 1, BIMV8075S (trade name, two-fluid nozzle manufactured by Ikeuchi Co., Ltd.) having a different flow rate was used. As a surface treatment agent, the same MECSEAL CL-5018S as in Example 1 was used. The spray time was set to 20 seconds.

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Abstract

The invention provides a surface processing method for forming an antirust film on Cu or Cu alloy by using a surface treating agent containing imidazole compound. The method includes steps of forming a resin layer with an opening on the surface of Cu or Cu alloy, and contacting the surface treating agent being mist particles with particle size less than 100 mum with the surface of Cu or Cu alloy in the opening.

Description

technical field [0001] The present invention relates to a copper or copper alloy surface treatment method for uniformly coating a copper or copper alloy surface treatment agent containing an imidazole compound on the surface of copper or copper alloy in particular small-diameter holes. Background technique [0002] For example, in order to prevent rust, improve solderability, etc., a surface treatment agent is used to form an anti-rust film on the surface of copper or copper alloy on which wiring is formed on the printed circuit board. As such a surface treatment agent, a surface treatment agent containing an imidazole compound as a main component of a formed antirust film is conventionally known. JP-A-4-99285 discloses the use of 2-alkyl benzimidazoles and organic acids at 20 to 60°C for a contact time of 1 second to several minutes. The method may be immersion or spraying. of any kind. Japanese Patent Publication No. 10-511431 discloses a method of dipping or spraying or...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F15/00
Inventor 古川良昭冈田万佐夫矢熊纪子
Owner MEC CO LTD
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