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Reflow-soldering decoder module of stack PCB (Printed Circuit Board)

A technology for decoders and solder pads, applied in the direction of instruments, hybrid readers, printed circuit manufacturing, etc., can solve the problems of lack of flexibility, high cost of ASIC single-chip decoders, long development and setup, etc.

Pending Publication Date: 2018-03-20
HAND HELD PRODS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ASIC single-chip decoders are expensive, and development and setup are lengthy processes
Lack of flexibility is another concern of ASIC single-chip solutions

Method used

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  • Reflow-soldering decoder module of stack PCB (Printed Circuit Board)
  • Reflow-soldering decoder module of stack PCB (Printed Circuit Board)
  • Reflow-soldering decoder module of stack PCB (Printed Circuit Board)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0064] see now Figure 1A with Figure 1B , which shows a decoder board subassembly 10 of the prior art. Such as Figure 1A As shown in , the prior art decoder board subassembly includes a decoder board 11 , a camera module 12 and a system board 13 . Such as Figure 1B As shown in , a prior art decoder board subassembly 10 includes fasteners 14 , flex PCB cables 15 and board-to-board connectors 16 for connecting decoder board 11 to system board 13 . It has been determined that cables (like flex PCB cables 15) and board connectors (like board-to-board connectors 16) are unreliable because it can be a marker read when these cables and / or connections have been found to become disconnected source of faults in the device. For example, screws (like fasteners 14 ) may become loose, allowing decoder board 11 to become disconnected from board-to-board connector 16 and / or flex PCB cable 15 . In addition, these flex cables and board-to-board connectors take up space and require suffi...

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PUM

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Abstract

The invention relates to a surface mounting technology (SMT) decoder assembly used for marking a reading device, which comprises a main printed circuit board (PCB), a processor chip and a plurality ofreflow-soldering pads, wherein the main PCB is a double-sided PCB provided with a top side and a bottom side, the processor chip is located at the top side of the main PCB, and the plurality of reflow-soldering pads are located at the bottom side of the main PCB so as to perform surface mounting on the decoder assembly.

Description

technical field [0001] The present disclosure relates generally to indicia reading devices, and more particularly, to indicia reading devices and methods for producing indicia reading devices employing stacked printed circuit board ("PCB") reflowable decoder modules. Background technique [0002] In general, indicia reading devices (also called scanners, laser scanners, image readers, indicia readers, mobile computers, terminals, etc.) typically read indicia carried by printed or displayed information (also called Data represented as symbols, symbologies, barcodes, etc.). Barcodes, such as UPC codes, use patterns of thick and thin lines to represent data, while more complex decoding systems (known as 2D matrix codes) use complex square patterns and arrangements to store information. [0003] One-dimensional (1D) or linear optical barcode readers are characterized by reading data encoded along a single axis in the presence of lines and spaces and / or the width of lines and sp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K7/00H05K3/34
CPCH05K3/3494G06K7/0004H05K1/181H05K1/111
Inventor C.冯L.王J.卢J-M.皮奇T.仙E.C.布雷默
Owner HAND HELD PRODS