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electronic package

An electronic package and packaging layer technology, applied in electrical components, circuits, antenna parts, etc., can solve problems such as inability to high bandwidth, difficult operation of the wireless communication module 1, and operation.

Active Publication Date: 2020-05-05
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, it is known that in the wireless communication module 1, the antenna part 131 is a complete rectangular plate, such as figure 1' As shown, the electromagnetic radiation characteristics of the antenna part 131 will operate at a low bandwidth (2.4GHz to 5.8GHz), but cannot operate at a high bandwidth
[0005] In addition, because the scattered emission of electromagnetic radiation will affect the operation of other electronic components, it is often difficult for the wireless communication module 1 to operate

Method used

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Embodiment Construction

[0068] The implementation of the present invention is described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0069] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for the understanding and reading of those familiar with this technology, and are not used to limit the implementation of the present invention Therefore, it has no technical substantive meaning. Any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of this invention without affecting the effect and purpose of the present invention. The technical content disclosed by the invention must be within the scope covered. At the same time, terms such as "above", "first",...

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Abstract

An electronic package comprises a bearing structure and an antenna structure arranged on the bearing structure. The antenna structure comprises a plurality of antenna plates and connection wires thatconnect the antenna plates. The current is divided into multiple paths, and the electromagnetic radiation of current is radiated to form high bandwidth.

Description

technical field [0001] The invention relates to an electronic package, especially an electronic package with an antenna structure. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. At present, wireless communication technology has been widely used in various consumer electronic products to receive or send various wireless signals. In order to meet the design requirements of consumer electronic products, the manufacture and design of wireless communication modules are moving towards light, Thin, short, and small requirements for development, among which, the planar antenna (Patch Antenna) is widely used in mobile phones (cell phones), personal digital assistants (Personal Digital Assistant, PDA) due to its small size, light weight, and easy manufacturing. ) and other wireless communication modules of electronic products. [0003] figure 1...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/12H01Q1/36H01Q1/50H01Q1/22H01Q21/00
CPCH01Q1/12H01Q1/2283H01Q1/36H01Q1/50H01Q21/00
Inventor 张峻源蔡明汎林河全卢盈维马光华
Owner SILICONWARE PRECISION IND CO LTD