Method and device for cooling after pcb pressing

A technology of a cooling device and a cooling method, which is applied in the direction of multilayer circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of cumbersome and time-consuming cooling process operations, and achieve the effect of solving cumbersome and time-consuming operations and improving efficiency

Active Publication Date: 2020-08-18
江西景旺精密电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above deficiencies in the prior art, the purpose of the present invention is to provide a method and device for cooling after PCB lamination, aiming to solve the problem of cumbersome and time-consuming cooling process in the prior art

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  • Method and device for cooling after pcb pressing
  • Method and device for cooling after pcb pressing
  • Method and device for cooling after pcb pressing

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Embodiment 1

[0033] The content of the invention will be further described below by describing the embodiments in conjunction with the accompanying drawings.

[0034] Please refer to figure 1 , figure 1 It is a structural schematic diagram of a cooling device after PCB lamination provided by the present invention. The cooling device after the PCB pressing includes a refrigeration device and a PLC controller (not shown in the figure), the refrigeration device is used to cool the pressed PCB board, and the PLC controller is used to The process parameters set the working frequency of the refrigeration device, so that the refrigeration device can complete the cooling of the PCB board within a predetermined time. In this embodiment, the refrigeration device includes a board-in mechanism 10, at least one cooling mechanism, and a board-out mechanism 70; the board-in mechanism 10, at least one cooling mechanism, and the board-out mechanism 70 are arranged side by side in sequence along the runni...

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Abstract

The invention discloses a cooling method and apparatus used after PCB pressing. The cooling apparatus comprises a refrigerating apparatus and a PLC controller; the refrigerating apparatus comprises aboard inlet mechanism, at least one cooling mechanism and a board outlet mechanism arranged in sequence; each cooling mechanism comprises a hollow wire cabin and a transfer mechanism positioned in thewire cabin and connected with the board inlet mechanism and the board outlet mechanism; the wire cabin is provided with a refrigerating mechanism used for providing a cold source for the wire cabin,a circulation fan, and a temperature sensor used for detecting the temperature in the wire cabin; and the refrigerating mechanism and the temperature sensor are both connected with the PLC controller.By virtue of the PLC controller, the transfer speed of the transfer mechanism and the wire cabin temperature can be controlled, the PCB cooling time after pressing can be controlled effectively, andthe needed cooling time of the PCB is controlled to be about 10min; and therefore, the problems of troublesome operation and long time consumption of the existing cooling process are solved, thereby improving PCB processing efficiency.

Description

technical field [0001] The invention relates to the field of PCBs, in particular to a method and device for cooling a PCB after lamination. Background technique [0002] Today, with the rapid development of electronic technology, PCB, as the basis of electronic technology development, has also been developed and applied unprecedentedly. At this stage, after the hot pressing and cold pressing of the PCB, it is inevitable to have a certain temperature on the board surface, usually between 40-60°C. If the temperature of the board is high, the size cannot be stabilized, which leads to the inability to directly proceed to the next target drilling process. Generally, manual pick-and-place handling is used, which may easily cause the board to be scratched and scrapped. [0003] At present, the industry generally uses high-power fans to cool down the board surface, which not only increases the operation, but also takes a long time for the cooling process, thereby delaying the PCB m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/46H05K2203/1121
Inventor 吴伟辉何小强周锋罗志美
Owner 江西景旺精密电路有限公司
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