Method and device for cooling after pcb pressing
A technology of a cooling device and a cooling method, which is applied in the direction of multilayer circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of cumbersome and time-consuming cooling process operations, and achieve the effect of solving cumbersome and time-consuming operations and improving efficiency
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[0033] The content of the invention will be further described below by describing the embodiments in conjunction with the accompanying drawings.
[0034] Please refer to figure 1 , figure 1 It is a structural schematic diagram of a cooling device after PCB lamination provided by the present invention. The cooling device after the PCB pressing includes a refrigeration device and a PLC controller (not shown in the figure), the refrigeration device is used to cool the pressed PCB board, and the PLC controller is used to The process parameters set the working frequency of the refrigeration device, so that the refrigeration device can complete the cooling of the PCB board within a predetermined time. In this embodiment, the refrigeration device includes a board-in mechanism 10, at least one cooling mechanism, and a board-out mechanism 70; the board-in mechanism 10, at least one cooling mechanism, and the board-out mechanism 70 are arranged side by side in sequence along the runni...
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