Laser chip failure location analysis sample preparation method and middleware

Abstract

The invention relates to a laser chip failure positioning analysis sample preparation method and a middleware. According to the method, the middleware and a heat sink are taken down together, foot pads for protection are bonded to the periphery of a chip, the heat sink is removed through a grinding method, and a gold layer at a substrate is removed through continuous grinding until the chip substrate is fully exposed. The method is suitable for semiconductor laser chips in multiple packaging forms, different material systems such as group IIIV, groups II and VI and silicon-based semiconductorlaser chips, can directly prepare fine and brittle laser chip samples with the scale of hundred microns, is free of precision micro-nano-processing equipment, pays attention to the protection of the samples, and can effectively prevent the damage of the sample during the failed sample taking process or during the sample preparation. Detection points are on the same plane after the sample preparation so that a power-on test is convenient. The method utilizes a cleanable adhesive and a sample can be taken out so that later analysis is promoted.

Description

technical field [0001] The invention relates to a sample preparation method and middleware, belonging to the technical field of optical communication, in particular to a laser chip failure location analysis sample preparation method and middleware. Background technique [0002] Active optical devices are the basis of optical fiber communication. With the development and wide application of optical fiber communication systems, people have higher and higher requirements for the quality and reliability of active optical devices. As the core component of active optical devices, semiconductor laser chips have stricter quality and reliability requirements. The analysis of chip failure samples has gradually penetrated into the material level. The size of semiconductor laser chips is extremely small, on the order of hundreds of um. The material properties are fragile, so it is necessary to prepare samples of failed chip samples at a scale of hundreds of um, and pay attention to prot...

AI Technical Summary

Problems solved by technology

[0005] The present invention mainly solves the technical problem of low chip sample sampling rate and sample preparation success rate existing in the prior art, and provides a semiconductor laser chip failure location analysis sample preparation method and middleware

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