Abnormal detection method and device for printed circuit board
A printed circuit board and abnormal detection technology, applied in the field of computer equipment and storage media, devices, and abnormal detection methods of printed circuit boards, can solve the problem of high cost of abnormal detection of printed circuit boards, achieve low cost, avoid waste of resources, improve The effect of productivity
Active Publication Date: 2020-04-14
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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Problems solved by technology
[0005] Based on this, it is necessary to provide a low-cost and effective abnormality detection method, device, computer equipment and storage medium for unetched printed circuit boards to solve the problem of high cost of abnormality detection for unetched printed circuit boards
Method used
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Embodiment Construction
[0042] figure 1 It is a flow chart of an abnormality detection method for a printed circuit board in an embodiment. Such as figure 1 As shown, the method includes the following steps:
[0043] S102: Acquiring the extremely poor reference copper thickness of the unetched test printed circuit board.
[0044] The reference copper thickness extreme difference here may be the design copper thickness extreme difference of the test printed circuit board. The design copper thickness extreme difference refers to the difference between the maximum copper thickness and the minimum copper thickness of the printed circuit board design. Typically, a product is known to have poorly designed copper thickness.
[0045] S104. Determine the corresponding weight and reference etching angle according to the reference copper thickness extreme difference.
[0046] The reference etching angle is a parameter used to predict the abnormality of the unetched printed circuit board, which can be deter...
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The invention relates to an anomaly detection method and apparatus of a printed circuit board, computer equipment and a storage medium. The anomaly detection method of a printed circuit board includesthe steps: acquiring the reference copper thickness range of an unetched test printed circuit board; according to the reference copper thickness range, determining the corresponding weight and the reference etching angle; acquiring the practical copper thickness range of the printed circuit board to be tested; according to the weight, the reference etching angle and the practical copper thicknessrange, predicting the linewidth range of the test printed circuit board; and according to the predicted linewidth range, detecting whether the printed circuit board is abnormal. The anomaly detectionmethod of a printed circuit board can timely discover the abnormal situation of the test printed circuit board before the test printed circuit board is etched, so as to timely perform repairing whendetecting that the printed circuit board is abnormal to avoid waste of resources because the anomaly cannot be rescued after manufacturing of the circuit is completed, thus further improving the production capability of the printed circuit board. The anomaly detection method of a printed circuit board does not need expensive equipment, thus being low in cost, and can perform prediction by acquiring the practical copper thickness range.
Description
technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to an abnormality detection method, device, computer equipment and storage medium of a printed circuit board. Background technique [0002] Printed circuit board (PCB, Printed Circuit Board) is the carrier of electrical connection of electronic components. [0003] With the development of PCB in the direction of refinement and portability, circuit production capability has increasingly become a key indicator to test the technical level of PCB manufacturers. There are many factors that affect circuit production, among which copper thickness is an important factor that determines the circuit production capability. As we all know, different copper thickness conditions correspond to different circuit manufacturing capabilities. However, even under the condition of the same design copper thickness, due to the influence of process factors such as electroplati...
Claims
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IPC IPC(8): G01B21/02G01B21/08
CPCG01B21/02G01B21/08
Inventor 史宏宇李星张鹏伟
Owner GUANGZHOU FASTPRINT CIRCUIT TECH