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Packaging structure of optical module and packaging method thereof

An optical module and packaging structure technology, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the measurement error of the optical module, the cover plate cannot be uniformly attached to the optical module, and the distance between the cover plate and the shield. inconsistency etc.

Active Publication Date: 2020-08-07
PIXART IMAGING INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to solve the problem that the cover plate cannot fit the optical module evenly, there is an air gap between the cover plate and the shielding part of the optical module, and the distance between the cover plate and the shielding part is inconsistent, resulting in errors in the measurement of the optical module question

Method used

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  • Packaging structure of optical module and packaging method thereof
  • Packaging structure of optical module and packaging method thereof
  • Packaging structure of optical module and packaging method thereof

Examples

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Embodiment Construction

[0025] Various exemplary embodiments will be described more fully hereinafter with reference to the accompanying drawings, in which some exemplary embodiments are shown. However, inventive concepts may be embodied in many different forms and should not be construed as limited to the illustrative embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Like numbers indicate like components throughout.

[0026] It should be understood that although the terms first, second, third, etc. may be used herein to describe various components or signals etc., these components or signals should not be limited by these terms. These terms are used to distinguish one component from another component, or one signal from another signa...

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Abstract

A packaging structure of an optical module comprises a substrate, a shielding member, a photosensitive component and a cover plate. The shielding member is arranged on the substrate, and a first accommodating space is formed between the shielding member and the upper surface of the substrate. The photosensitive component is arranged on the substrate and positioned inside the first accommodating space. The shielding member has a light receiving part which is positioned above the photosensitive component. The shielding member is provided with at least one groove on the outer surface corresponding to the first accommodating space. A buffer member is arranged on each groove, and the buffer members protrude from the upper surface of the shielding member. The cover plate is arranged on the buffer members. The cover plate is kept a fixed distance from the upper surface of the shielding member through the contact with the buffer members. Therefore, the problem that measurement error is causedby the inconsistent spacing between the cover plate and the shielding member is solved.

Description

technical field [0001] The invention relates to a packaging structure and a packaging method thereof, and in particular to a packaging structure applicable to an optical module and a packaging method thereof. Background technique [0002] At present, the proximity optical sensing module has become the mainstream technology choice of various electronic devices. For example, when the electronic device is close to the user's face or placed in the pocket, the optical module can detect the object and make the electronic device immediately turn off the screen display and / or touch function to avoid false touches and save power consumption. For a better user experience. [0003] Wherein, the optical module uses a light source to emit a light, and the light is projected to a photosensitive component through reflection from the surface of the object, and then converted into an electronic signal for subsequent processing, so as to achieve the purpose of detecting the object. The ligh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L21/56
CPCH01L21/56H01L23/31H01L23/315H01L23/3157H01L2224/48091H01L2224/48227H01L2924/00014
Inventor 沈启智李国雄谢尚峰庄瑞诚
Owner PIXART IMAGING INC
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