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A flexible array substrate and its preparation method, display substrate, and display device

A flexible array and array substrate technology, which is applied in the fields of nonlinear optics, semiconductor/solid-state device manufacturing, instruments, etc., can solve the problems of low yield rate of display devices, broken signal lines, etc.

Active Publication Date: 2020-04-24
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, since a large number of signal lines are arranged in the non-display area 10, the signal lines are likely to be broken during the bending process, which in turn leads to a decrease in the yield of the display device.

Method used

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  • A flexible array substrate and its preparation method, display substrate, and display device
  • A flexible array substrate and its preparation method, display substrate, and display device
  • A flexible array substrate and its preparation method, display substrate, and display device

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Embodiment Construction

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0036] An embodiment of the present invention provides a flexible array substrate, such as figure 2 As shown, it includes a non-display area 10 and a display area 20 , the non-display area 10 includes a bending area 01 adjacent to the display area 20 , wherein signal lines 11 are arranged in the non-display area 10 .

[0037] Those skilled in the art should understand that the above-mentioned signal line does not absolutely mean that the signal line is only l...

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PUM

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Abstract

Embodiments of the present invention provide a flexible array substrate, a preparation method, a display substrate, and a display device, which relate to the field of display technology and can reduce the probability of signal lines breaking due to bending in a bending area. The flexible array substrate includes a display area and a non-display area. The non-display area includes a bending area adjacent to the display area; the bending area includes signal lines and auxiliary lines arranged on the base substrate, and the auxiliary lines are located away from the signal lines. One side of the base substrate; the insulating layer is provided with different groups of depressions formed by a plurality of depressions arranged along the extending direction of different signal lines in the area where the bending area overlaps with different signal lines, and the auxiliary line covers the group of depressions .

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a flexible array substrate and a preparation method, a display substrate, and a display device. Background technique [0002] Flexible display devices are more and more used in wearable devices, electronic paper and other fields in recent years because of their lightness, lightness, and bendability. Among them, in the prior art, the backplane in the flexible display device is generally bent The area is bent to achieve the effect of narrow frame or no frame of the flexible display device. [0003] Specifically, such as figure 1 As shown, the flexible display device includes a non-display area 10 and a display area 20. The non-display area 10 has a bending area 01 (Bonding Area) at a position close to the display area 20. Generally, the entire non-display area 10 is bonded along the bending area 01. towards the back of the display device (i.e. the non-display side, figu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12H01L21/77
CPCH01L27/1218H01L27/1244H01L27/1248H01L27/1259H10K59/1315G02F1/133305G02F1/136286G02F2201/42Y02E10/549G02F1/136272H10K59/1795H10K77/111H01L27/1262G02F1/1333H10K59/12
Inventor 张帅
Owner BOE TECH GRP CO LTD