Diamond wire cutting machine and wire arrangement control method thereof

Abstract

The invention discloses a diamond wire cutting machine and a wire arrangement control method thereof. The diamond wire cutting machine comprises a breakage detection device and a winding mechanism. The winding mechanism comprises a paying-off roller, a driving shaft, a driven shaft, a taking-up roller, an upper movable module, a lower movable module, an upper swing arm, a lower swing arm, a firstfixed guide wheel and a second fixed guide wheel, each movable module is provided with a movable guide wheel, and each swing arm is provided with a swing guide wheel. A diamond wire is led out from the paying-off roller, passes a first movable guide wheel, a first swing guide wheel and the first fixed guide wheel, is coiled on the driving shaft and the driven shaft to form a wire mesh, passes thesecond fixed guide wheel, a second swing guide wheel and a second movable guide wheel and finally is led into the taking-up roller. The breakage detection device changes the distance between a heavy punch and an approach switch after a drawn wire is broken. The method is characterized in that corresponding correction factors K are controlled and selected in a segmented manner according to the interval of Px. According to the diamond wire cutting machine and the method, the number of the guide wheels can be decreased, the rigidity of the diamond wire is enhanced, interference of water conductivity in breakage detection results is eliminated, and wires are vertically arranged as far as possible.

Description

technical field [0001] The invention relates to the field of cutting machinery and equipment, in particular to a diamond wire cutting machine and a wire arrangement control method thereof. Background technique [0002] In recent years, with the rapid development of the solar energy industry, the demand for hard and brittle materials such as monocrystalline silicon, polycrystalline silicon and piezoelectric ceramics has risen rapidly. As the main cutting equipment for hard and brittle materials such as solar silicon wafers, the diamond wire cutting machine has been more and more widely used due to its advantages of high cutting efficiency and good processing stability. [0003] The diamond wire cutting machine of the prior art includes a frame on which a feeding mechanism and a winding mechanism for wiring and cutting silicon materials are arranged on the frame, and the feeding mechanism includes clamps for fixing silicon materials and for connecting The lifting device of th...

AI Technical Summary

Problems solved by technology

[0004] The diamond wire cutting machine of the prior art has the following defects: the pay-off roller and the take-up roller are vertically arranged, and the winding mode of twelve guide wheels is adopted, the number of guide wheels is large, the diamond wire winding distance is long, and the wire The layout of the wheels is cumbersome, and the overall structure of the diamond wire cutting machine is not compact; and every time the diamond wire passes through a guide wheel, it needs to be bent and changed once, resulting in the loss of the stiffness of the diamond wire, and too many guide wheels will reduce the stiffness of the diamond wire and affect the tension. Instability, prone to disconnection, jumper problems

But the broken wire detection device of the diamond wire cutting machine in the prior art is a conductive rod arranged on the edge of the wire mesh, which is insulated at ordinary times. On the conductive rod, make the circuit form a loop, and the system will alarm

However, there is a defect in the above-mentioned detection device: that is, the diamond wire cutting machine uses water-based cutting fluid for cooling, and the water itself has conductivity, which may form a path at both ends of the insulator, causing the system to send a wrong alarm signal

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