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Integrated circuit packaged chip sorting machine

An integrated circuit and packaging chip technology, applied in the field of integrated circuit packaging chip sorting machine, can solve the problems of inconvenient maintenance, high cost, fine and complicated structure, etc., and achieve the effect of reducing cost, easy maintenance and strong practicability

Inactive Publication Date: 2018-05-04
张晓双
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies in the existing technology, the object of the present invention is to provide a kind of sorting machine for integrated circuit packaging chips, to solve the problem that the existing technology uses multiple large and small motors to operate, the structure is fine and complicated, the cost is high, and it is inconvenient repair

Method used

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  • Integrated circuit packaged chip sorting machine
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  • Integrated circuit packaged chip sorting machine

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Embodiment Construction

[0019] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0020] see Figure 1-Figure 4, the present invention provides a technical solution for a sorting machine for integrated circuit packaging chips: its structure includes a foot 1, a base 2, a baffle 3, a tester 4, a branch pipe 5, a controller 6, a barrel 7, a support plate 8, a reducing Vibration spring 9, bracket 10, platen 11, conveyor 12, four corners of the bottom of the base 2 are respectively equipped with feet 1, the top of the base 2 is fixedly connected with the platen 11, and the platen 11 is provided with an opening , the opening of the platen 11 is equipped with a conveyor 12, a checker 4 is arranged above the conveyor 12, and both sides of the checker 4 are fixedly connected with the platen 11 through brackets 10, and the checker 4 is ...

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Abstract

The invention discloses an integrated circuit packaging chip sorting machine, which structurally comprises bottom feet, a base, a baffle plate, an inspection device, a branch pipe, a controller, a material barrel, a supporting plate, a damping spring, a support, a bedplate and a conveyor. The bottom feet are arranged at the corners of the bottom of the base respectively. The top of the base is fixedly connected with the bedplate. An opening is formed in the bedplate. The conveyor is arranged at the opening of the bedplate. The inspection device is arranged above the conveyor. The two sides ofthe inspection device are fixedly connected with the bedplate through the support. The inspection device is electrically connected with the controller. The controller is fixedly connected to the top of the branch pipe. The bottom of the branch pipe is fixed on the side surface of the bedplate. The material barrel is arranged at the input end of the conveyor. The two sides of the material barrel are welded with the supporting plate. The bottom of the supporting plate is elastically connected with the bedplate through the damping spring. The integrated circuit packaged chip sorting machine is reasonable in design, and all working procedures can be completed by only one motor of the sorting machine. The cost is reduced, and the maintenance is convenient. The practicability is high, and the economic benefit is good.

Description

technical field [0001] The invention relates to a sorting machine for integrated circuit packaging chips, which belongs to the field of sorting machines for integrated circuit packaging chips. Background technique [0002] The inspection of the quality of the integrated circuit package is an important process to ensure that the integrated circuit package can work normally. [0003] The existing technology uses multiple large and small motors to operate, and the structure is fine and complicated, the cost is high, and it is not easy to maintain. Contents of the invention [0004] Aiming at the deficiencies in the existing technology, the object of the present invention is to provide a kind of sorting machine for integrated circuit packaging chips, to solve the problem that the existing technology uses multiple large and small motors to operate, the structure is fine and complicated, the cost is high, and it is inconvenient repair. [0005] In order to achieve the above ob...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67271
Inventor 张晓双张朋亮李钊
Owner 张晓双
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