Inverse piezoelectric effect-based MEMS microstructure four-shaft type off-chip vibration excitation device

Abstract

An inverse piezoelectric effect-based MEMS microstructure four-shaft type off-chip vibration excitation device disclosed by the present invention comprises a sleeve, the stacked piezoelectric ceramics, a pressure sensor, the upper and lower connecting blocks and an MEMS microstructure, and is characterized in that a supporting plate and an electric lead screw transmission mechanism connected withthe lower connecting block are arranged in the sleeve, the lower end of the upper connecting block is equipped with a hemispherical round head and presses on the lower connecting block, and the piezoelectric ceramics are clamped between the pressure sensor and an elastic supporting member; the ball head plungers are uniformly distributed on the circumference between the upper connecting block andthe sleeve, the steel balls at the inner ends of the ball head plungers push into a chute at the outer edge of the upper connecting block, and the guiding shafts penetrating the lower connecting blockare uniformly distributed in the sleeve. The device can apply different pre-tightening forces on the stacked piezoelectric ceramics flexibly, so that the pre-tightening force measurement values are more accurate, an adjustment process for compensating a parallelism error of the two working surfaces of the stacked piezoelectric ceramics becomes more smooth, the shear forces between the stacked piezoelectric ceramics are reduced, and the dynamitic characteristic parameters of the MEMS microstructure are convenient to test.

Description

technical field [0001] The invention belongs to the technical field of micromechanical electronic systems, in particular to a MEMS microstructure four-axis off-chip excitation device based on the inverse piezoelectric effect. Background technique [0002] Due to the advantages of low cost, small size and light weight, MEMS microdevices have broad application prospects in many fields such as automobile, aerospace, information communication, biochemistry, medical treatment, automatic control and national defense. For many MEMS devices, the micro-displacement and micro-deformation of their internal microstructures are the basis for the realization of device functions. Therefore, accurate testing of dynamic characteristic parameters such as the amplitude, natural frequency, and damping ratio of these microstructures has become the key to developing MEMS products. important content. [0003] In order to test the dynamic characteristic parameters of the microstructure, it is firs...

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Problems solved by technology

[0006] 2. There is no direct connection between the upper connection block and the lower connection block and the sleeve, but are installed in the sleeve in turn by means of clearance fit. If the parallelism error of the two working surfaces of the stacked piezoelectric ceramics is large , there is not enough space to adjust the movable base structure;

[0007] 3. The pressure sensor is installed at the bottom of the lower connecting block. Since the movable base structure adjusts itself, there is a certain inclination between the bottom of the lower connecting block and the working surface of the piezoelectric ceramic, so the pre-tightening force measured by the pressure sensor Or the output force of piezoelectric ceramics is not accurate; in addition, if the movable base structure causes the upper coupling block or the lower coupling block to contact the sleeve after adjustment, the error of the measurement result will further increase;

[0009] 5. In this device, gaskets of different thicknesses are used to change the magnitude of the pre-tightening force applied to the stacked piezoelectric ceramics, which makes the adjustment process complicated and not flexible enough

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