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On-board SPI Flash programming system and method

An on-board, writing operation technology, applied in the direction of instruments, electrical digital data processing, computing, etc., can solve the problem that the programming system and method cannot be concise, efficient and comprehensive to deal with sudden erasing and programming faults and programming needs, and cannot be performed On-site maintenance and other issues, to achieve the effect of simple and convenient equipment maintenance, save the process of erasing and writing, and save cumbersome steps

Pending Publication Date: 2018-05-11
北京神州龙芯集成电路设计有限公司
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AI Technical Summary

Problems solved by technology

For some scattered deployments, especially in outdoor environments, once such problems occur, on-site maintenance is often impossible
[0008] Therefore, for the on-board SPI Flash bare chip programming problem, whether it is the test and development process before leaving the factory, or the upgrade and update operation after it has been put into use, the existing programming system and method cannot be concise, efficient and comprehensive. Response to sudden erase and write failures and programming needs

Method used

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  • On-board SPI Flash programming system and method
  • On-board SPI Flash programming system and method
  • On-board SPI Flash programming system and method

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Embodiment Construction

[0049] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0050] Such as figure 1 Shown, in one embodiment, provide a kind of programming system and method of on-board SPI Flash, this system comprises embedded processor, DDR2 memory chip, EJTAG debug interface and the SPIFlash chip that has been welded on the integrated circuit board;

[0051] in:

[0052] Embedded processor is used to connect SPI Flash chip, DDR2 memory chip and EJTAG debugging interface, and on-chip integrates EJTAG debugging unit, DMA controller, DDR2 controller and SPI controller; In this specific embodiment, described embedding The processor adopts the Shenzhou Godson processor, and the processor model is GSC3280.

[0053] The system programming work revolves around the system startup program, and its work steps include:

[0054]Through the EJTAG debugging unit...

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Abstract

The invention provides an on-board SPI Flash programming system. The system comprises an embedded processor chip, a memory module, a processor debugging interface, and an SPI Flash chip fixedly connected to an integrated circuit board; the embedded processor chip is connected with the SPI Flash chip, the memory module and the processor debugging interface; the SPI Flash chip is used for saving a system startup program; the memory module is used for caching the system startup program transmitted by an upper computer; the processor debugging interface is connected with a processor debugging unitof an embedded processor and the upper computer from the exterior of the embedded processor chip. Meanwhile, a programming method based on the system is provided and can greatly simplify complicatedreprogramming work caused by failure of on-board SPI Flash erasing or programming.

Description

technical field [0001] The invention relates to an SPI (Serial Peripheral Interface) Flash chip programming system and method, in particular to a board-mounted SPI Flash programming system and method. Background technique [0002] Currently programming SPI Flash is usually performed using a programmer. [0003] For SPI Flash, there are a variety of packaging forms, the more common ones are DIP (dual in-line package), SOP (Small Out-Line Package), TSSOP (Thin Shrink Small Outline Package) Shrink small size package), etc. The dedicated programmer for SPI Flash can provide Socket slots for packages of various specifications, so this kind of programming work is carried out before the SPI Flash is soldered to the integrated circuit board. [0004] In practical applications, in order to resist vibration or save the size of the integrated circuit board, SPI Flash with smaller package size such as SOP and TSSOP is often selected and soldered on the integrated circuit board, which ...

Claims

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Application Information

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IPC IPC(8): G06F8/654
Inventor 宋兴嘉
Owner 北京神州龙芯集成电路设计有限公司
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