Array substrate and manufacturing method thereof, display panel and display device thereof

An array substrate and substrate substrate technology, which is applied to display panels and display devices, and a manufacturing method thereof, in the field of array substrates, can solve the problems of low fingerprint recognition speed and sensitivity, and achieve improved speed and sensitivity, high sensitivity and fast response speed. Effect

Active Publication Date: 2018-05-18
BOE TECH GRP CO LTD
View PDF5 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, using photosensitive diodes as photosensitive elements, the speed and sensitivity of fingerprint recognition are not high.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Array substrate and manufacturing method thereof, display panel and display device thereof
  • Array substrate and manufacturing method thereof, display panel and display device thereof
  • Array substrate and manufacturing method thereof, display panel and display device thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] In order to illustrate the present invention more clearly, the present invention will be further described below in conjunction with preferred embodiments and accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. Those skilled in the art should understand that the content specifically described below is illustrative rather than restrictive, and should not limit the protection scope of the present invention.

[0047] Various cross-sectional views according to disclosed embodiments of the invention are shown in the drawings. The figures are not drawn to scale, with certain details exaggerated and possibly omitted for clarity of presentation. The shapes of various regions and layers shown in the figure, as well as their relative sizes and positional relationships are only exemplary, and may deviate due to manufacturing tolerances or technical limitations in practice, and those skilled in the art may Regions / layers with different ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an array substrate. The array substrate comprises a substrate body, a piezoelectric induction layer which is formed on the substrate body, an acoustic surface wave excitation electrode and an acoustic surface wave receiving electrode which are formed on the piezoelectric induction layer and a photosensitive resistance layer which is formed on the piezoelectric induction layer, and the photosensitive resistance layer is located between the acoustic surface wave excitation electrode and the acoustic surface wave receiving electrode. The invention further discloses a display panel and a display device which comprise the array substrate. The array substrate, the display panel and the display device use the acoustic surface wave excitation electrode and the acoustic surface wave receiving electrode with fast response, high sensitivity and small volume to realize a fingerprint recognition function, and can improve the fingerprint recognition speed and sensitivity.

Description

technical field [0001] The invention relates to the field of display technology. More specifically, it relates to an array substrate, a manufacturing method thereof, a display panel and a display device. Background technique [0002] With the development of science and technology, fingerprint identification technology is widely used in various electronic devices by virtue of the security identification function it provides. [0003] Existing fingerprint identification usually detects the reflected light of the finger, and judges whether the corresponding position is a fingerprint valley or a fingerprint ridge according to the difference in light intensity of the reflected light between the fingerprint valley and the fingerprint ridge, thereby forming a fingerprint image at the corresponding position. In the prior art, a photosensitive diode is usually used to output different photocurrents under different light irradiations, and then a fingerprint image is obtained through ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00
CPCG06V40/1318G06V40/1306
Inventor 刘英伟姚琪梁志伟曹占锋任庆荣陈一民
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap