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Liquid processing device

A process device and liquid technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of liquid process machine component damage, equipment damage, etc.

Active Publication Date: 2018-05-29
SCIENTECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, if there is a crack on the wafer, when the liquid processing machine applies liquid to the surface of the rotating wafer, the liquid may pass through the crack and be sucked by the suction of the pumping channel. The sucked liquid will penetrate into the air extractor or other components inside the liquid process machine through the suction channel, causing damage to the components of the liquid process machine
[0004] Therefore, it is necessary to provide a new liquid process machine, which can prevent the liquid from flowing into the liquid process machine improperly and cause equipment damage

Method used

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Embodiment Construction

[0057] In order to enable your review committee members to better understand the technical content of the present invention, the preferred specific embodiments are described as follows.

[0058] Please refer to the following Figure 1 to Figure 2 Regarding the liquid processing device of the first embodiment of the present invention. figure 1 It is a schematic diagram of the liquid processing device of the first embodiment of the present invention; figure 2 It is a schematic diagram of the separation of liquid and gas in the gas-liquid separation unit according to the first embodiment of the present invention.

[0059] In the first embodiment of the present invention, as figure 1 with figure 2 As shown, the liquid processing device 1 of the present invention is used to supply a liquid L to the surface of a wafer W for liquid processing. The liquid L is, for example, an acid liquid or a cleaning liquid, which can be applied on the surface of the wafer W for etching or cle...

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Abstract

A liquid processing apparatus is used for supplying a liquid to a surface of a wafer for a liquid process. The liquid processing apparatus includes a base, a rotating shaft, a fixing member, a liquidsupply member, a leakage preventing member and a gas supply member. The rotating shaft is coupled to the base and has an in-shaft passage. The fixing member is connected to the rotating shaft and is used for fixing the wafer, and the fixing member has a penetrating through hole, which communicates with the in-shaft passage. The liquid supply member provides a liquid to the surface of the wafer. The leakage preventing member is in communication with the through hole. The gas supply member communicates with the leak preventing member and provides a source of gas to the fixing member. When a liquid enters the rotating shaft from the through hole of the fixing member, the liquid flows into the leakage preventing member to prevent the liquid from flowing to the gas supply member.

Description

technical field [0001] The invention relates to a liquid process device, in particular to a liquid process device which can prevent liquid from improperly flowing into the liquid process device and causing equipment damage. Background technique [0002] In the process of making semiconductor wafers, it is necessary to place the wafer on the liquid process machine, let the wafer rotate on the liquid process machine, and let the liquid process machine apply acid to the surface of the wafer for etching ; After the etching process is finished, the liquid process machine will apply cleaning liquid to the surface of the wafer for cleaning. A general liquid process machine has a rotating platform, an air extraction channel and an air extractor. One end of the air extraction channel is connected to the air extractor, and the other end passes through the rotating platform. In this way, when the air extractor draws air, the end of the air extraction channel on the rotating platform w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67017H01L21/67034H01L21/6704H01L21/67051H01L21/67057H01L21/67075H01L21/67155H01L21/6838H01L21/68757H01L21/68785
Inventor 冯傳彰吴庭宇蔡文平刘茂林李威震
Owner SCIENTECH