Cooling water channel structure suitable for Pin-Fin power semiconductor module

A power semiconductor, pin-fin technology, applied in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of poor cooling effect, unbalanced heat dissipation, adverse overall life of power semiconductor modules, etc. Overall life, effect of optimized runner design

Active Publication Date: 2018-06-08
SUZHOU LVKON NEW ENERGY TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The cooling channel of the existing Pin-Fin power semiconductor module has a good cooling effect near the inlet of the channel, and a poor cooling effect near the outlet of the channel. Long-term unbalanced heat dissipation is not conducive to the overall life of the power semiconductor module.

Method used

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  • Cooling water channel structure suitable for Pin-Fin power semiconductor module
  • Cooling water channel structure suitable for Pin-Fin power semiconductor module
  • Cooling water channel structure suitable for Pin-Fin power semiconductor module

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Embodiment Construction

[0023] A cooling channel structure suitable for Pin-Fin power semiconductor modules, see Figure 1-Figure 3 : It includes a waterway housing 1, a liquid inlet chamber 2, a cooling chamber 3, and a liquid outlet chamber 4 are arranged in parallel in the inner cavity formed by the waterway housing 1, and liquid inlet chambers are respectively arranged on both sides of the long side of the cooling chamber 3 2. The liquid outlet chamber 4, the lower part of the Pin-Fin pin 6 at the bottom of the power semiconductor module 5 is placed in the cooling chamber 3 and evenly arranged, one end of the liquid inlet chamber 3 is provided with a liquid inlet interface 7, and the outer wall of the liquid outlet chamber 4 A liquid outlet interface 8 is provided, and a first guide area 9 is provided at the connection area between the liquid inlet interface 7 and the liquid inlet chamber 2, and N pieces of liquid inlet guide plates are arranged at the rear of the first guide area 9 corresponding ...

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Abstract

The present invention provides a cooling water channel structure suitable for a Pin-Fin power semiconductor module. Through an optimized channel design, the cooling water channel structure ensures a consistent cooling effect of a whole power semiconductor module and ensures the whole life of the power semiconductor module. The cooling water channel structure comprises a water channel housing, a liquid inlet chamber, a cooling chamber and a liquid outlet chamber are arranged in parallel in an inner cavity formed by the water channel housing, the liquid inlet chamber and the liquid outlet chamber are respectively arranged at two sides of a long edge of the cooling chamber, part of the lower ends of the Pin-Fin pins at the bottom portion of the power semiconductor module are arranged in the cooling chamber and uniformly arranged, one end of the liquid inlet chamber is provided with an liquid inlet interface, the outer wall of the liquid outlet chamber is provided with a liquid outlet interface, a first guidance area is arranged at a connection area of the liquid inlet interface and the liquid inlet chamber, N blocks of liquid inlet guidance plates are arranged at the back portion of the first guidance area corresponding to the liquid flow direction, the height directions of the liquid inlet guidance plates cover a liquid height area of liquid inlet.

Description

technical field [0001] The invention relates to the technical field of cooling water channel structures, in particular to a cooling water channel structure suitable for Pin-Fin power semiconductor modules. Background technique [0002] In the existing cooling channel of the Pin-Fin power semiconductor module, the cooling effect is good near the inlet of the channel, and the cooling effect is poor near the outlet of the channel. Long-term unbalanced heat dissipation is not conducive to the overall life of the power semiconductor module. Contents of the invention [0003] In view of the above problems, the present invention provides a cooling channel structure suitable for Pin-Fin power semiconductor modules, which ensures consistent cooling effect of the entire power semiconductor module through optimized flow channel design, and ensures the overall life of the power semiconductor module. [0004] A cooling water channel structure suitable for Pin-Fin power semiconductor mo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/473
CPCH01L23/473
Inventor 李磊张雷黄全安
Owner SUZHOU LVKON NEW ENERGY TECH CO LTD
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