Device and method for preparing polyimide dielectric layer and electronic circuit on curved surface

Abstract

The invention provides a device and a method for preparing a polyimide dielectric layer and an electronic circuit on a curved surface. Based on a moving platform, by the aid of a 3D (three-dimensional) printing technology, prepared polyimide precursor solution with a certain concentration is printed on a curved surface substrate, electronic paste is printed on a formed film to form the electroniccircuit, the metal substrate is heated by an auxiliary heating device in the printing process, solvents in the polyimide precursor solution are promoted to rapidly volatilize, and film thickness unevenness caused by flow due to gravity action in the printing process is prevented. The device and the method can solve the problems of poor shaping precision, complicated forming process and the like due to the fact that shaping and gluing are performed after a circuit is printed on a traditional film. The polyimide dielectric layer and the electronic circuit can be prepared on the undeveloped curved surface once by the process technology, hand-made models related to the research and development process of the field of intelligent wear, conformal antennas, photovoltaic devices and the like are rapidly verified, and product research and development periods are shortened.

Description

technical field [0001] The invention relates to the technical field of preparing polyimide dielectric layers and electronic circuits on curved surfaces, in particular to a device and method for preparing polyimide dielectric layers and electronic circuits on curved surfaces. Background technique [0002] At present, with the development of the electronics industry, the demand for curved surface electronic circuits in industries such as photovoltaics, mobile phone antennas, and microwave antennas is becoming more and more obvious. Polyimide is one of the organic polymer materials with the best comprehensive performance, high temperature resistance up to 400 °C, high insulation performance, dielectric constant of 4.0 at 103 Hz, and dielectric loss of only 0.004 to 0.007, so it is often used as a microstrip antenna And the dielectric layer of flexible circuits. [0003] The manufacturing process of the traditional microstrip antenna is to combine the copper foil and polyimide ...

AI Technical Summary

Problems solved by technology

Through the processing technology of the above traditional electronic circuit, it can be seen that the manufacturing process is cumbersome, complicated and the cycle is long

At the same time, the microstrip antenna or thin film circuit printed on polyimide is limited by the shape of the product when it is finally shaped into the product. It cannot be formed on a non-expanded curved surface, and the shape of a regular curved surface also involves precision issues.

The current manufacturing process limits the application of dielectric layers and electronic circuits on curved surfaces and heterogeneous substrates, so a new process method is urgently needed to deal with the current processing and manufacturing problems

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