37 results about "Polyimide dielectric" patented technology

Laminate structures are disclosed, comprising a metal foil supporting a polyimide dielectric layer. The polyimide dielectric layer comprises a polyimide derived from at least one aromatic rigid rod diamine and at least one aromatic rigid rod dianhydride to provide a thermally and dimensionally stable polyimide. A bottom electrode is formed directly on the polyimide dielectric layer surface, and a CIGS absorber layer is formed directly on the bottom electrode. The CIGS laminates of the present disclosure can be incorporated into CIGS type solar cells, and the laminates further allow such CIGS solar cells to be monolithically integrated into a photovoltaic module on a single substrate.

Methods for adhering polyimide dielectric materials to copper-, titanium-, aluminum-, or copper-and-titanium-containing portions of a substrate are described. The methods include the steps of applying adhesion promoter to a clean surface of the substrate, and curing the adhesion promoter. SPIE varnish is applied over the cured adhesion promoter, and is itself cured. A further layer of adhesion promoter is applied over the cured SPIE varnish, and is cured. The polyimide dielectric material is then laminated to the adhesion promoter. Cleaning of the copper-containing substrate portions is performed by etching with etchant including cupric chloride, cleaning of the titanium-containing substrate portions is performed with etchant including HF, and cleaning of copper- and titanium-containing portions is performed by HF etching followed by cupric chloride etching. Aluminum-containing portions of the substrate are not etched.

The present invention provides a 3-bit transmission type electromagnetic code metamaterial applied in a terahertz band. A basic unit structure is formed by the alternative arrangement of three layers of metal opening resonant ring structures and four layers of polyimide dielectric layers. Through the optimization design of the geometric parameter of an opening resonant ring structure, each unit can show eight independent refraction phases under the irradiation of a y polarization vertical incident electromagnetic wave, and the eight independent refraction phases are corresponding to number states '0' to '7'. According to digital codes designed in advance, number units are arranged on a two-dimensional plane, and the 3-bit transmission type electromagnetic code metamaterial is formed. In the terahertz band, the 3-bit transmission type electromagnetic code metamaterial can refract the incident electromagnetic wave, and the abnormal refraction is realized. Due to the excellent mechanical and chemical performance of the polyimide dielectric, the3-bit transmission type electromagnetic code metamaterial has the advantages of flexibility, corrosion resistance and physical wear resistance and has a wide application prospect in the aspects of terahertz imaging and communication.

The invention provides a polyimide dielectric heat-conduction composite material and a preparation method thereof. 1, 3-bis(4-aminophenoxy)benzene APB, 4,4-(hexafluoroisopropylidene) diphthalic anhydride 6FDA and 1,3-bis(3-aminopropyl)tetramethyldisiloxane GAPD serve as raw materials, cubic boron nitride hBN serves as a heat-conduction filler, hBN/polyamide acid heat-conduction composite fiber is prepared by means of the in-situ polymerization-electrostatic spinning method, and then an hBN/PI dielectric heat-conduction composite material with high thermal conductivity and low dielectric is obtained through the thermal imidization-clipping stacking-moulding pressing technology. The prepared hBN/PI dielectric heat-conduction composite material has the advantages of being high in heat conduction, low in dielectric property and excellent in heat resistance.

A method and system for adjusting characteristics of a relative humidity sensor in order to achieve a desired value of accuracy is presented. A relative humidity sensor, charge balance circuit include a series of sensing capacitors Cx1, Cx2 comprising of thin porous platinum top plate, a humidity sensitive polyimide dielectric, and two metal bottom plates on a semiconductor substrate; and two fixed oxide capacitances Cref, and C0. Changes in humidity affect the humidity sensitive dielectric thereby causing changes in the sensing capacitive value of the said capacitive circuit. The charge in the sensing capacitor and the fixed capacitor C0 can be controlled separately by adjusting and/or trimming the supply voltage using a voltage trimmer; thereby the slope and offset of the relative humidity sensor circuit can be modified and controlled to particular desired values

The invention relates to a semiconductor device and a manufacturing method thereof. The method comprises steps: a substrate is provided, and an element and an interconnection structure above the element are formed on the substrate; a benzocyclobutene dielectric layer or a polyimide dielectric layer is formed on the substrate; a metal pad is formed on the dielectric layer to be connected with the interconnection structure; and two wafers comprising the dielectric layer and the metal pad are bonded. In order to solve the problems in the prior art, a new material is selected as the dielectric layer in the horizontal wafer Cu-Cu bonding technology, benzocyclobutene (BCB) or polyimide is selected as the dielectric layer, bonding between the upper wafer and the lower wafer is realized, BCB of the upper wafer and the lower wafer can be melted together during the bonding process, a bonding pair free of a void is formed, and the bonding quality is improved. The BCB can serve as a blocking layer, and the problem of metal diffuse (such as Cu diffuse) between the wafers can be solved completely.

The invention provides a device and a method for preparing a polyimide dielectric layer and an electronic circuit on a curved surface. Based on a moving platform, by the aid of a 3D (three-dimensional) printing technology, prepared polyimide precursor solution with a certain concentration is printed on a curved surface substrate, electronic paste is printed on a formed film to form the electroniccircuit, the metal substrate is heated by an auxiliary heating device in the printing process, solvents in the polyimide precursor solution are promoted to rapidly volatilize, and film thickness unevenness caused by flow due to gravity action in the printing process is prevented. The device and the method can solve the problems of poor shaping precision, complicated forming process and the like due to the fact that shaping and gluing are performed after a circuit is printed on a traditional film. The polyimide dielectric layer and the electronic circuit can be prepared on the undeveloped curved surface once by the process technology, hand-made models related to the research and development process of the field of intelligent wear, conformal antennas, photovoltaic devices and the like are rapidly verified, and product research and development periods are shortened.

The invention discloses a polyimide dielectric film and a preparation method and application thereof. The preparation method comprises the following steps: under the protection of inert gas, raw materials of the polyimide dielectric film and a polar organic solvent are mixed and stirred to carry out reactions to obtain a precursor mixed solution, film casting is conducted after defoaming, and a heat treatment is conducted. Raw materials of the polyimide dielectric film comprise an aromatic diamine compound, an aromatic tetra-carboxylic dianhydride compound and nano powder, and the energy bandgap of the nano powder is larger than 4 eV. Or the raw materials of the polyimide dielectric film comprise an aromatic diamine compound II and an aromatic tetra-carboxylic acid dianhydride compound II, and the aromatic diamine compound II and the aromatic tetra-carboxylic acid dianhydride compound II contain at least one of carbonyl, ether bonds, cyano, amido, sulfonyl and methylene. The preparation method of the polyimide dielectric film is simple in process and low in cost, and the prepared polyimide dielectric film has a high dielectric constant, a high energy storage density and high-temperature and high-electric-field stability.

The invention discloses a preparation method of trenches of polyimide-embedded syconoid ridge type devices, comprising the following steps: step 1: growing a source layer and a limiting layer on the surface of a substrate in sequence, which are used as a basic structure of a device; step 2: manufacturing a photoetching graph on the surface of the limiting layer; step 3: photoetching: etching a syconoid ridge type structure on the surface of the limiting layer, wherein, the etching depth reaches the surface of the source layer; step 4: coating polyimide dielectric layers in the syconoid ridge type structure and on the surface of the limiting layer, and procuring; step 5: coating photoresist on the surface of the polyimide dielectric layer, and drying; and step 6: exposing, developing and removing the polyimide dielectric layers on the syconoid ridge type structure and on the surface of the limiting layer, and curing to finish manufacture of the device.

The invention discloses a transmissible and reflective dual-function terahertz wave beam splitter and a method thereof. The terahertz wave beam splitter comprises a terahertz wave input end and N*N unit structures, wherein N is a natural number; the N*N unit structures are periodically arranged on a plane perpendicular to the input direction of terahertz waves, and each unit structure comprises an all-dielectric cylindrical structure, a polyimide dielectric layer and a substrate vanadium dioxide; the number of the unit structures is two, the all-dielectric cylindrical structure of one unit structure is a first isosceles triangular cylinder, the all-dielectric cylindrical structure of the other unit structure is a large isosceles triangular cylinder, middle dielectric layers of the two unit structures are both polyimide, and bottom layers of the two unit structures are both vanadium dioxide; and the bottom vanadium dioxide realizes an effect of controlling the transmission and reflection of the designed structure after reaching a phase change condition. The transmissible and reflective dual-function terahertz beam splitter is simple in structure, materials are easy to prepare, conversion of transmission and reflection can be achieved through temperature changes under the condition that the structure is not changed, and the application requirement of a terahertz wave system is met.

The invention relates to a beam lead capacitor processing method, and the method comprises the following steps: 1, providing a nickel plate, and forming a TiW metal film on the nickel plate through employing a sputter coating method; 2, forming a polyimide dielectric film on the nickel plate through employing a photoetching method; 3, forming a TiW/Au metal layer structure through employing the sputter coating method, and covering the polyimide dielectric film; 4, forming the upper and lower electrodes of a beam lead capacitor through employing a photoetching electroplating method; 5, selectively etching the nickel plate through employing the photoetching method, maintaining the mechanical supporting action of the nickel plate, and enabling the upper and lower electrodes to form circuit break. The invention aims at providing the method which is simpler in processing. Compared with a method provided by a foreign manufacturer, the method improves the production efficiency, reduces the cost, and is worthy of polularization in production.

The invention discloses a multi-frequency terahertz metamaterial absorber based on surface plasmon polaritons, the absorber is composed of an absorber unit array, the absorber unit is composed of a three-layer structure in which two metal layers, namely a top design metal pattern layer and a bottom metal backboard layer, are attached with a polyimide dielectric layer, and the three-layer structureis tightly attached; the top design metal pattern layer adopts a double-split-ring pattern orthogonal I-shaped pattern structure; each of the top design metal pattern layer and the bottom metal backplate layer adopts a gold and chromium double-layer metal composite structure, so that the adhesion between the structures is improved. The absorption peak based on the surface plasmon polariton modeis realized in the range of 0.3 THz to 2THz by utilizing the matching relationship between the structural period of the absorber unit and the size of the top-layer design metal pattern layer, and theabsorption peak has the characteristics of high absorption rate and high quality factor.

The invention discloses an adjustable reflective linear polarization controller and a method. The controller comprises a terahertz wave input end and N*N unit structures, wherein the N is a natural number; the N*N unit structures are periodically arranged on a plane vertical to the input direction of terahertz waves, and each unit structure comprises a top-layer metal structure, a polyimide dielectric layer and a substrate metal plate; the top-layer metal structure is located above the polyimide dielectric layer, the top-layer metal structure is formed by combining a double-opening circular ring, a double-opening square ring, a rectangular metal piece and a rectangular unit, and the opening directions of the double-opening circular ring and the double-opening square ring are located in an auxiliary diagonal line; and the double-opening circular ring and the double-opening square ring are connected through a rectangular metal piece located on a main diagonal line, and a rectangular unit is embedded into an opening of the double-opening square ring, located in the center of the metal structure layer and below the polyimide dielectric layer and plated with a layer of metal plate. The adjustable reflection type linear polarization controller is simple and compact in structure, convenient to manufacture and adjust and capable of meeting the application requirement of a terahertz wave system.

The invention discloses a polyimide thin dielectric film. The film is formed by performing condensation polymerization and subsequent thermal imidization on diamine monomer containing polar groups and/or a flexible key joint structure and dianhydride monomer containing polar groups and/or a flexible key joint structure. The method comprises the following steps: dissolving the diamine monomer intoan organic solvent under the protection of inert gas, then adding the dianhydride monomer, and stirring, so as to obtain a homogeneous solution, and continuously performing reaction for 4 to 10 hoursat certain temperature, so as to obtain a polyamide acid (PAA) solution; coating the polyamide acid solution onto a substrate, performing heating and drying treatment, then soaking the substrate intoa deionized water, so as to perform peeling, and then performing drying treatment again, so as to obtain the polyimide thin dielectric film. The polyimide thin dielectric film can tolerate 230 DEG C temperature. The polyimide thin dielectric film is applied to metallic film capacitors.

The invention discloses a focusing type terahertz polarization controller. The focusing type terahertz polarization controller is characterized by comprising a terahertz wave incident end, a reflected terahertz wave output end and a metasurface polarizer, wherein the metasurface polarizer is formed by periodically arranging N * N structural units on a plane perpendicular to the input direction of terahertz waves, wherein N is a natural number; each array unit is obtained by anticlockwise rotating 4 * 4 concave metal microstructures with notches by taking alph = 22.5 degrees as a step length; and each concave metal microstructure with the notch comprises sequentially a metal notch concave on the top layer, a polyimide dielectric layer on the middle layer and a metal plate on the bottom layer from top to bottom. The focusing type terahertz polarization controller has the advantages of being simple in structure, easy to machine and the like; different focus orientations can be generated for incidence of terahertz waves in different polarization states, and the application requirement of a terahertz wave communication multiplexing system is met.

The invention discloses a preparation method of a high temperature-resistant composite polyimide dielectric material. According to the process, raw materials such as copper sulfate, dimethyl sulfone,ethanol, calcium carbonate, silicon dioxide, methyl hydroxybenzoate, polyimide, polyphenylene sulfide, polylactic acid fiber, benzoin dimethyl ether, lead magnesium niobate and polyvinyl alcohol are respectively subjected to the steps such as ultrasonic dispersion, centrifugal washing, drying, stepwise vacuum high temperature reaction, ice bath cooling, pressure banburying, extrusion granulation,molding and packaging to prepare the high temperature-resistant composite polyimide dielectric material. The prepared high temperature-resistant composite polyimide dielectric material is good in hightemperature resistance, anti-aging property and dielectric property, and can meet multiple user needs.

The invention provides a polyimide dielectric material and a dielectric film. The dielectric material is obtained by an esterification reaction of carboxyl-containing polyimide and hydroxylated carbonnanotubes. According to the invention, the polyimide and the carbon nanotubes are compounded, so that the dielectric property of the polyimide is effectively improved.

The invention discloses a device for improving adhesive property of a polyimide substrate exciter by low-temperature plasma. The device comprises a high-voltage DC power supply (101), a DC voltage power output end (102), an insulation handle (103), a first insulation body (104), a second insulation body (105), a third insulation body (106), a fourth insulation body (107), a fifth insulation body (108), a discharging positive electrode (109), a pulley (110), a negative electrode metal plate (111), a sliding way (112) and a plasma body discharging region (113). The invention also provides the special operation process of surface treatment of the exciter. The surface of the plasma exciter is subjected to effects of impact and modification of the plasma, the adhesive property of the exciter can be improved and enhanced, and the polyimide dielectric blocking discharging plasma exciter with favorable adhesive property is generated after repeated operation for many times. By the method, the adhesive property of the plasma exciter can be substantially improved.

The invention discloses a circularly polarized phased-array antenna unit composed of a metal waveguide, a polyimide dielectric material, a matching structure, a connector, and a circular polarizer. The metal waveguide is made of a metal material and has an inverted-L shape. The L-shape has a square top and a rectangular side. The polyimide dielectric material fully fills the metal waveguide, and apolyimide dielectric block protrudes from the metal waveguide. The connector is a waveguide feed structure and is fixedly connected in a space under the metal waveguide. The connector has two probes,one of which is a signal input end connected to a signal source, and the other one of which is an output end connected to the side of the metal waveguide. The side of the metal waveguide is a feed waveguide cavity having the matching structure therein. The matching structure is a stepped pyramid structure connected to the probe at the output end of the connector. The circular polarizer is a stepped diaphragm structure and is located at the intermediate position of the top of the metal waveguide. The circularly polarized phased-array antenna unit is easy to process and ensures the qualified rate and precision of a product.

The invention discloses a technology of planarizing a ridge waveguide device by using polyimide. The technology comprises the following steps of S1, coating the polyimide on a sample surface; S2, solidifying the polyimide on a sample, and during solidification, maintaining the flow of a nitrogen gas to be 30sccm; and S3, through a microwave degumming machine, etching the solidified polyimide on the sample surface. In the invention, the microwave degumming machine is used to carry out etching so as to realize planarization, and a microwave discharge etching rate and efficiency are high; ion bombardment damages are small and radiation damages are small too; and an electrode in a discharge internal portion can be covered by an insulating material. In the technology, a microwave method and a solidification technology are combined and are used in polyimide dielectric film planarization so that a device damage risk and planarization technology difficulty are greatly reduced.

The invention discloses a foldable digital microfluidics (DMF) device using a flexible electronic platform and a manufacturing method of the foldable digital microfluidics (DMF) device. A foldable digital microfluidic device includes a flexible polyimide substrate having thin copper features, the flexible polyimide substrate being foldable to provide an opposing plurality of substrates. The foldable digital microfluidic device also includes a flexible polyimide dielectric layer also having thin copper features. In some embodiments, the structure used to form the foldable digital microfluidic device of the present disclosure is based on the use of blind holes. In some embodiments, a foldable digital microfluidic device includes a droplet actuation layer. In other embodiments, a foldable digital microfluidic device includes a plurality of droplet actuation layers. Further, a method of manufacturing a foldable digital microfluidic device is disclosed.