37 results about "Polyimide dielectric" patented technology

An improved relative humidity sensor apparatus that provides a more accurate measurement of humidity in the presence of water condensation. A series capacitive sensor includes a thin porous platinum top plate, a humidity sensitive polyimide dielectric, and two metal bottom plates on a semiconductor substrate. The two capacitors can be wired in series such that the metal bottom plates form independent, electrically driven connections. The thin top layer can form a top plate. Changes in humidity affect the humidity sensitive dielectric thereby causing changes in the capacitive value. A P-well layer and a P-plus layer can be added at the perimeter of the substrate to create a path for a parasitic capacitance caused by water condensation to connect to one or more connection nodes, thereby preventing erroneous measurements of humidity in the presence of water condensation.

A method and system for adjusting characteristics of a relative humidity sensor in order to achieve a desired value of accuracy is presented. A relative humidity sensor charge balance circuit includes a series of sensing capacitors Cx1, Cx2 including a thin porous platinum top plate, a humidity sensitive polyimide dielectric, and two metal bottom plates on a semiconductor substrate; and two fixed oxide capacitances Cref, and C0. Changes in humidity affect the humidity sensitive dielectric thereby causing changes in the sensing capacitive value of the capacitive circuit. The charge in the sensing capacitor and the fixed capacitor C0 can be controlled separately by adjusting and / or trimming the supply voltage using a voltage trimmer; thereby the slope and offset of the relative humidity sensor circuit can be modified and controlled to particular desired values.

The invention discloses a polyimide thin dielectric film. The film is formed by performing condensation polymerization and subsequent thermal imidization on diamine monomer containing polar groups and / or a flexible key joint structure and dianhydride monomer containing polar groups and / or a flexible key joint structure. The method comprises the following steps: dissolving the diamine monomer intoan organic solvent under the protection of inert gas, then adding the dianhydride monomer, and stirring, so as to obtain a homogeneous solution, and continuously performing reaction for 4 to 10 hoursat certain temperature, so as to obtain a polyamide acid (PAA) solution; coating the polyamide acid solution onto a substrate, performing heating and drying treatment, then soaking the substrate intoa deionized water, so as to perform peeling, and then performing drying treatment again, so as to obtain the polyimide thin dielectric film. The polyimide thin dielectric film can tolerate 230 DEG C temperature. The polyimide thin dielectric film is applied to metallic film capacitors.

The invention provides a device and a method for preparing a polyimide dielectric layer and an electronic circuit on a curved surface. Based on a moving platform, by the aid of a 3D (three-dimensional) printing technology, prepared polyimide precursor solution with a certain concentration is printed on a curved surface substrate, electronic paste is printed on a formed film to form the electroniccircuit, the metal substrate is heated by an auxiliary heating device in the printing process, solvents in the polyimide precursor solution are promoted to rapidly volatilize, and film thickness unevenness caused by flow due to gravity action in the printing process is prevented. The device and the method can solve the problems of poor shaping precision, complicated forming process and the like due to the fact that shaping and gluing are performed after a circuit is printed on a traditional film. The polyimide dielectric layer and the electronic circuit can be prepared on the undeveloped curved surface once by the process technology, hand-made models related to the research and development process of the field of intelligent wear, conformal antennas, photovoltaic devices and the like are rapidly verified, and product research and development periods are shortened.

The invention discloses an adjustable reflective linear polarization controller and a method. It includes a terahertz wave input terminal, N×N unit structures, N is a natural number; N×N unit structures are periodically arranged on a plane perpendicular to the input direction of the terahertz wave, and the unit structure includes a top metal structure, a polyimide dielectric layer, substrate metal plate; wherein, the top metal structure is located above the polyimide dielectric layer, and the top metal structure is composed of a double-opening ring, a double-opening square ring, a rectangular metal piece and a rectangular unit, and the double-opening The opening direction of the circular ring and the double-opening square ring is located on the secondary diagonal, and the double-opening circular ring and the double-opening square ring are connected by a rectangular metal piece located on the main diagonal. The rectangular unit is embedded in the opening of the double-opening square ring, located at The center of the metal structure layer is coated with a metal plate under the polyimide dielectric layer. The adjustable reflective linear polarization controller of the present invention has the advantages of simple and compact structure, convenient manufacture and convenient adjustment, and meets the application requirements of the terahertz wave system.

Disclosed is a device for improving the bonding performance of a polyimide substrate actuator by using low-temperature plasma, comprising: a high-voltage DC power supply (101), a DC voltage power supply output terminal (102), an insulating handle (103), a first insulator ( 104), second insulator (105), third insulator (106), fourth insulator (107), fifth insulator (108), discharge anode (109), pulley (110), cathode metal plate (111), slide track (112) and plasma discharge area (113). It also provides the specific operation process for the surface treatment of the actuator. The surface of the plasma actuator is impacted and modified by the plasma, and the bonding characteristics of the actuator are improved and strengthened. After repeated operations several times, a polyimide dielectric barrier discharge plasma actuator with excellent bonding characteristics is produced. . Using this method can greatly improve the adhesion of the plasma actuator.