The embodiment of the invention discloses a method for making a circuit pattern on a multilayer PCB and relates to the technical field of PCB manufacturing methods. The method is used for manufacturing the circuit pattern with higher precision on the multilayer PCB. The method includes the steps that a dry film is pasted to the surface of a metal layer of the multilayer PCB, exposure is carried out on the multilayer PCB with the dry film pasted to obtain an exposed area and a non-exposed area, and the portion, located in the non-exposed area, of the dry film is removed; etching treatment is carried out on the portion, located in the non-exposed area, of the metal layer so that the circuit pattern corresponding to the exposed area can be formed on the portion, located in the exposed area, of the metal layer; the surface, corresponding to the exposed area, of the circuit pattern is covered by a protective layer; a via hole is formed in the portion, where the circuit pattern corresponding to the exposed area is located, of the multilayer PCB. The method is mainly applied to manufacturing PCB circuit patterns.