Polyimide dielectric heat-conduction composite material and preparation method thereof

A heat-conducting composite material, polyimide-mediated technology, applied in the preparation of polyimide dielectric heat-conducting composite materials, the field of polyimide dielectric heat-conducting composite materials, can solve the problem of filling a single high heat conduction, to achieve heat conduction The effect of increasing the coefficient

Active Publication Date: 2017-03-08
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] There are relatively few studies on PI dielectric and heat-conducting composite materials at home and abroad, and most...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0018] A preparation method of a polyimide dielectric heat-conducting composite material, comprising the steps of:

[0019] (a) 6.5% to 7.5% by weight of APB is put into a three-necked flask equipped with a stirrer and a nitrogen conduit, and 75% to 86% by weight of DMAc is added under ice-water bath conditions. After APB is completely dissolved, 10.6% to 86% by weight of DMAc 12.3% by weight of 6FDA was added in batches (the weight of each batch of 6FDA was not more than 0.2000 g, and the next batch was added after the previous batch of 6FDA was completely dissolved). After all 6FDA is added and dissolved, 0.29%-0.34% by weight of GAPD is added. Stir mechanically for 30 minutes, add 5% to 30% by weight of hBN, continue to stir for 30 to 60 minutes, and polymerize in situ to obtain hBN / polyamic acid (hBN / PAA) solution;

[0020] (b) Pack the hBN / PAA solution through step (a) into an 8ml injection needle tube equipped with a metal needle, then fix the injection needle tube hori...

Embodiment 1

[0023] Example 1: Put 1.6078g of APB into a three-necked flask equipped with a stirrer and a nitrogen conduit, add 13.5200g of DMAc under ice-water bath conditions, add 2.6656g of 6FDA in batches after the APB is completely dissolved, and wait until 6FDA is completely dissolved After adding and dissolving, add 0.0745g of GAPD, stir mechanically for 30min, then add 0.1527g of hBN, continue stirring for 30min, in situ polymerization to obtain hBN / PAA solution; put the hBN / PAA solution into an 8ml syringe equipped with a metal needle , and then fix the injection needle horizontally on the injection device, connect the positive electrode connector of the high-voltage power supply of the electrospinning instrument to the metal needle, wrap the tin foil collection paper on the negative electrode of the cylinder, and align the injection needle with the center of the cylinder to maintain static electricity The working chamber of the spinning instrument is sealed, and the temperature of...

Embodiment 2

[0025]Example 2: Put 1.6078g of APB into a three-necked flask equipped with a stirrer and a nitrogen conduit, add 22.3600g of DMAc under ice-water bath conditions, add 2.6656g of 6FDA in batches after the APB is completely dissolved, and wait until 6FDA is completely dissolved After adding and dissolving, add 0.0745g of GAPD, mechanically stir for 30min, then add 1.2437g of hBN, continue stirring for 60min, in situ polymerization to obtain hBN / PAA solution; put the hBN / PAA solution into an 8ml syringe equipped with a metal needle , and then fix the injection needle horizontally on the injection device, connect the positive electrode connector of the high-voltage power supply of the electrospinning instrument to the metal needle, wrap the tin foil collection paper on the negative electrode of the cylinder, and align the injection needle with the center of the cylinder to maintain static electricity The working chamber of the spinning instrument is sealed, and the temperature of ...

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PUM

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Abstract

The invention provides a polyimide dielectric heat-conduction composite material and a preparation method thereof. 1, 3-bis(4-aminophenoxy)benzene APB, 4,4-(hexafluoroisopropylidene) diphthalic anhydride 6FDA and 1,3-bis(3-aminopropyl)tetramethyldisiloxane GAPD serve as raw materials, cubic boron nitride hBN serves as a heat-conduction filler, hBN/polyamide acid heat-conduction composite fiber is prepared by means of the in-situ polymerization-electrostatic spinning method, and then an hBN/PI dielectric heat-conduction composite material with high thermal conductivity and low dielectric is obtained through the thermal imidization-clipping stacking-moulding pressing technology. The prepared hBN/PI dielectric heat-conduction composite material has the advantages of being high in heat conduction, low in dielectric property and excellent in heat resistance.

Description

technical field [0001] The invention relates to a dielectric and heat-conducting composite material, in particular to a polyimide dielectric and heat-conducting composite material, and also relates to a preparation method of the polyimide dielectric and heat-conducting composite material. Background technique [0002] Polyimide (PI) has many advantages such as outstanding heat resistance, excellent chemical stability, good electrical insulation and excellent mechanical properties, and has a wide range of high-tech fields such as aviation, aerospace, optics and electronic equipment. Application prospect. However, PI itself has poor thermal conductivity (thermal conductivity λ is 0.174W / mK), which limits its application. In order to further expand the application of PI in high heat transfer and heat dissipation applications such as electronic components and integrated circuits, improving the thermal conductivity of PI substrates is the key technology. [0003] There are rela...

Claims

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Application Information

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IPC IPC(8): D01F6/94D01F1/10C08L79/08C08K3/38C08G73/10C09K5/14D04H1/728D01D1/02D01D5/00B32B37/10B32B27/28
CPCB32B5/26B32B37/10B32B2262/02B32B2307/302C08G73/1071C08K3/38C08K2003/385C08L2203/12C09K5/14D01D1/02D01D5/0015D01F1/10D01F6/94D04H1/728C08L79/08
Inventor 顾军渭吕昭媛张秋禹郭永强李万正
Owner NORTHWESTERN POLYTECHNICAL UNIV
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