Foldable digital microfluidic devices using flexible electronic platforms and methods of making same

A technology of digital microfluidics and flexible substrates, which is applied in the direction of microelectronic microstructure devices, fluid controllers, microstructure devices, etc., can solve the problems of dielectric uniformity and surface flatness, droplet driving reliability reduction, droplet Problems such as limited transmission speed, to achieve the effects of simplified manufacturing, low electrowetting voltage, and good performance

Pending Publication Date: 2022-03-01
NICOYA LIFESCI INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Additionally, PCB-based substrates may have limitations in terms of dielectric uniformity and surface flatness
These limitations can lead to perf

Method used

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  • Foldable digital microfluidic devices using flexible electronic platforms and methods of making same
  • Foldable digital microfluidic devices using flexible electronic platforms and methods of making same
  • Foldable digital microfluidic devices using flexible electronic platforms and methods of making same

Examples

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Embodiment Construction

[0026] figure 1 A side view of an example of a digital microfluidic structure 100 on which the foldable digital microfluidic (DMF) device of the present disclosure is based is shown. In this example, the digital microfluidic structure 100 is a structure based on the use of blind vias. For example, the digital microfluidic structure 100 can be formed Figure 2 to Figure 9 The basis for a foldable digital microfluidic device 200 of the present disclosure is shown.

[0027] The digital microfluidic structure 100 may include a polyimide substrate 110 that may further include an arrangement of multiple droplet-operated electrodes 112 that may be formed using blind via techniques. For example, the plurality of droplet operations electrodes 112 may include an actuation electrode 114 on one side of the polyimide substrate 110 and an external electrode 116 on the other side of the polyimide substrate 110 . Each of the actuation electrodes 114 and the external electrodes 116 may then...

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Abstract

The invention discloses a foldable digital microfluidics (DMF) device using a flexible electronic platform and a manufacturing method of the foldable digital microfluidics (DMF) device. A foldable digital microfluidic device includes a flexible polyimide substrate having thin copper features, the flexible polyimide substrate being foldable to provide an opposing plurality of substrates. The foldable digital microfluidic device also includes a flexible polyimide dielectric layer also having thin copper features. In some embodiments, the structure used to form the foldable digital microfluidic device of the present disclosure is based on the use of blind holes. In some embodiments, a foldable digital microfluidic device includes a droplet actuation layer. In other embodiments, a foldable digital microfluidic device includes a plurality of droplet actuation layers. Further, a method of manufacturing a foldable digital microfluidic device is disclosed.

Description

technical field [0001] The presently disclosed subject matter generally relates to microfluidic devices for performing assays, and more particularly, to foldable Digital Microfluidic (DMF) devices using flexible electronic platforms and methods of fabrication thereof. Background technique [0002] In digital microfluidic technology, a digital microfluidic (Digital Microfluidic, DMF) device is usually a printed circuit board (PCB)-based digital microfluidic device or cartridge (also known as a droplet manipulation device). For example, a printed circuit board based substrate is provided relative to a glass or plastic substrate. A printed circuit board-based substrate may include an arrangement of droplet operations electrodes (e.g., electrowetting electrodes). A glass or plastic substrate may include a substantially optically transparent ground reference electrode, such as an indium tin oxide (ITO) ground reference electrode. .There is a gap between the printed circuit board...

Claims

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Application Information

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IPC IPC(8): G01N1/00G01N21/75
CPCG01N21/553B01L3/502792B01L2200/025B01L2300/0816B01L2300/123B01L2300/161B01L2400/0427B01L2300/0887B01L2300/0645B81B2201/058B81C1/00119B81C2203/032B01L2200/0673B01L2300/0663B01L2200/12B01L2300/0883
Inventor 戈登·霍尔
Owner NICOYA LIFESCI INC
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