Technology of planarizing ridge waveguide device by using polyimide

A technology of polyimide and ridge waveguide, which is applied in the direction of optical waveguide and light guide, can solve the problems of poor repeatability and complex planarization process, achieve small radiation damage, small ion bombardment damage, reduce device damage analysis and planarization process effect of difficulty

Inactive Publication Date: 2018-06-15
HENAN SHIJIA PHOTONS TECH
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  • Abstract
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Problems solved by technology

[0004] The technical problem to be solved by the present invention is the technical problem that the existing flattening process is complex and poor in repeatability, thereby providing a process for flattening the ridge waveguide device by polyimide, which is simple and repeatable, low in cost, and avoids The cumbersome overlay process and mechanochemical polishing and planarization process in the photolithography process have almost no damage to the key interface

Method used

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  • Technology of planarizing ridge waveguide device by using polyimide
  • Technology of planarizing ridge waveguide device by using polyimide
  • Technology of planarizing ridge waveguide device by using polyimide

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Embodiment 1

[0019] Embodiment 1: A kind of technology that polyimide makes ridge waveguide device planarization, the steps are as follows: S1, polyimide is coated on the surface of the sample, and the sample is a double-groove ridge laser, such as figure 1 As shown, after coating as figure 2 shown.

[0020] S2, the polyimide on the sample is cured, the flow of protective nitrogen gas is 30sccm during curing, the structure diagram after curing is as follows image 3 shown.

[0021] S3. Etch the cured polyimide on the surface of the sample through a microwave degumming machine. The power of the microwave degumming machine is 50W~120W, and the flow rate of oxygen is 20sccm~200sccm. The etching time depends on the depth of the groove and the thickness of the glue. implementation; after etching as Figure 4 shown.

Embodiment 2

[0022] Example 2: A process for flattening a ridge waveguide device by polyimide, taking a double-groove ridge-shaped high-frequency laser with a wavelength of 1.3 / 1.5um as an example, the width of the ridge-shaped mesa in the active layer is 2um, and both sides The channel width is 7 um, the channel depth is 1.7 um, the profile is as follows Figure 5 ; After implementing the process technology of the present invention, the polyimide embeds the local channel effect of the ridge structure device, and the profile is as follows Figure 6 .

[0023] The operation is as follows: step 1, homogenize the polyimide on the surface of the sample, and coat it with a homogenizer, the speed of the homogenizer is 5000 rpm, and the thickness of the coated polyimide after curing is 2 times the depth of the trench to be buried. ~3 times. And ZKPI-540 photosensitive polyimide or non-photosensitive polyimide or BCB can be used.

[0024] Step 2, the sample is cured, and the temperature and tim...

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Abstract

The invention discloses a technology of planarizing a ridge waveguide device by using polyimide. The technology comprises the following steps of S1, coating the polyimide on a sample surface; S2, solidifying the polyimide on a sample, and during solidification, maintaining the flow of a nitrogen gas to be 30sccm; and S3, through a microwave degumming machine, etching the solidified polyimide on the sample surface. In the invention, the microwave degumming machine is used to carry out etching so as to realize planarization, and a microwave discharge etching rate and efficiency are high; ion bombardment damages are small and radiation damages are small too; and an electrode in a discharge internal portion can be covered by an insulating material. In the technology, a microwave method and a solidification technology are combined and are used in polyimide dielectric film planarization so that a device damage risk and planarization technology difficulty are greatly reduced.

Description

technical field [0001] The invention belongs to the technical field of photolithography technology for manufacturing semiconductor devices, in particular to a technology for flattening ridge waveguide devices by polyimide. Background technique [0002] With the rapid development of optical communication technology, the bandwidth requirements of optoelectronic devices are getting higher and higher. It is not only necessary to optimize the device structure, but also to innovate the dielectric manufacturing process to reduce capacitance. Surfaces with etched grooves or holes usually require dielectric filling to achieve good fabrication of electrodes. For example, for a ridge waveguide high-frequency laser with a wavelength of 1.3 / 1.5um, it is required to fill in the 7um channels on both sides of the ridge waveguide depth of about 1.7um. Polyimide, removed elsewhere, the buried structure requires a planarization process to achieve. [0003] There are usually three methods to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/13
CPCG02B6/13
Inventor 黄永光王宝军刘祎慧
Owner HENAN SHIJIA PHOTONS TECH
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