Laminate structures for high temperature photovoltaic applications, and methods relating thereto

a technology of photovoltaic applications and laminates, applied in the field of thermodynamic stability and dimensional stability of polyimideonmetal laminates, can solve the problems of insufficient thermal and dimensional stability of conventional polyimides at desired cigs processing temperatures, glass lacks flexibility, and can be heavy, bulky and subject to breakag

Inactive Publication Date: 2009-11-26
EI DU PONT DE NEMOURS & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0004]The present disclosure is directed to CIGS laminate structures comprising a metal foil having a thickness from 5 to 100 microns, where the metal foil supports a polyimide dielectric layer having a thickness from 8 to 100 microns. The polyimide dielectric layer is in direct contact with the metal foil and comprises a polyimide derived from at least one aromatic rigid rod diamine and at least one aromatic rigid rod dianhydride to provide a polyimide having a glass transition temperature (“Tg”) greater than 300° C. and a polyimide dielectric layer having an isothermal weight loss of less than 1% at 500° C. over 30 minutes (in an inert atmosphe...

Problems solved by technology

However, glass lacks flexibility and can be heavy, bulky and subject to breakage.
While polyimides are known for high temperature stabi...

Method used

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  • Laminate structures for high temperature photovoltaic applications, and methods relating thereto
  • Laminate structures for high temperature photovoltaic applications, and methods relating thereto

Examples

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example 1

[0050]A random polyamic acid copolymer of BPDA / PMDA / / PPD / 4,4′ODA of about a 95 / 5 / / 92 / 8 molar ratio was prepared by standard methods in DMAC at about 15% solids with a slight excess of amine to a viscosity of about 50-100 poise (hereafter referred to as “prepolymer”). To this prepolymer solution, a freshly prepared solution of 6 wt % PMDA in DMAC was added in small portions incrementally to increase the molecular weight of the polymer and give a viscosity of about 500 poise as measured on a Brookfield DV-II+ viscometer at 20 rpm with a #5 spindle (hereafter referred to as “finished polymer”). The finished polymer solution was cast onto a heated glass plate and dried at about 80° C. to a tack free coating that was then carefully removed from the glass surface to yield a DMAC-containing free-standing film. This film was placed on a pin frame and placed in an oven at 120° C. for 30 minutes. Afterwards, the oven temperature was ramped to 320° C. over about 20 minutes and held at 320° C. ...

example 2

[0051]A slurry of HR-2 mica from Kish Company (Mentor, Ohio, USA) was prepared by dispersing about 70 g in 116.2 g of DMAC utilizing a Silverson high shear mixer. After the mica was thoroughly wetted out by the solvent, a small portion (13.8 g) of the prepolymer from Example 1 was added and the slurry was allowed to further mix for about 30 min. A portion of this slurry (17.7 grams) was added to a larger portion of the prepolymer from Example 1 (179.6 g) and this mixture was stirred for about 1 hour using a high torque mixer. To this prepolymer / filler mixture, small portions of PMDA in DMAC were added incrementally in order to increase the polymer molecular weight and bring the viscosity of the mixture to about 500 poise (Brookfield, ref. Example 1). This finished polymer / mica mixture was cast into a film and cured in a similar manner to that described in Example 1 to yield a filled polyimide film containing about 20 wt % mica.

example 3

[0052]In a similar manner to Example 2, a second portion (41.5 g) of the slurry described in Example 2 was added to a 156.2 g portion of the prepolymer from Example 1. This prepolymer / mica mixture was finished, cast and cured in a manner similar to that described in Examples 1 and 2 to yield a filled polyimide film containing about 40 wt % mica.

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Abstract

Laminate structures are disclosed, comprising a metal foil supporting a polyimide dielectric layer. The polyimide dielectric layer comprises a polyimide derived from at least one aromatic rigid rod diamine and at least one aromatic rigid rod dianhydride to provide a thermally and dimensionally stable polyimide. A bottom electrode is formed directly on the polyimide dielectric layer surface, and a CIGS absorber layer is formed directly on the bottom electrode. The CIGS laminates of the present disclosure can be incorporated into CIGS type solar cells, and the laminates further allow such CIGS solar cells to be monolithically integrated into a photovoltaic module on a single substrate.

Description

FIELD OF DISCLOSURE[0001]This disclosure relates generally to thermally and dimensionally stable polyimide-on-metal laminates for high temperature photovoltaic applications. More specifically, the laminates of the present invention enable monolithic integration of CIGS type photovoltaic cells.BACKGROUND OF THE DISCLOSURE[0002]Photovoltaic devices, e.g., solar cells, are capable of converting solar radiation into usable electrical energy. One type of solar cell involves the use of copper indium gallium di-selenide (“CIGS”). In the manufacture of CIGS solar cells, CIGS deposition technology generally requires very high processing temperatures, generally above 450° C., for higher photovoltaic efficiency. Glass and metal have been used as substrates for CIGS photovoltaic cells, due to their thermal and dimensional stability at high temperatures. However, glass lacks flexibility and can be heavy, bulky and subject to breakage. Metal has advantages over glass, but the inherent electrical ...

Claims

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Application Information

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IPC IPC(8): H01L31/042H01L31/00
CPCB32B15/08C08G73/1039C08G73/1042C08G73/1067Y02E10/541C08G73/1082H01L31/0322H01L31/0392C08G73/1075B32B3/085B32B5/02B32B15/12B32B15/14B32B15/18B32B27/08B32B27/18B32B27/20B32B27/281B32B2255/02B32B2255/10B32B2255/12B32B2255/20B32B2255/205B32B2255/28B32B2260/021B32B2260/028B32B2260/046B32B2262/101B32B2262/106B32B2264/101B32B2264/102B32B2307/204B32B2307/206B32B2307/30B32B2307/308B32B2307/718B32B2307/734B32B2457/12H01L31/03928Y02P70/50
Inventor AUMAN, BRIAN C.BOUSSAAD, SALAHCARNEY, THOMAS EDWARDKANAKARAJAN, KUPPUSAMYKOURTAKIS, KOSTANTINOSSIMMONS, JOHN W.
Owner EI DU PONT DE NEMOURS & CO
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