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Polyimide dielectric film and preparation method and application thereof

A polyimide dielectric and film technology, applied in the field of polyimide dielectric film and its preparation, can solve the problem that it is difficult to obtain high polarization due to the miniaturization, light weight and high temperature environment application of electronic devices Strength, low dielectric constant of aromatic PI, etc., to achieve the effect of inhibiting injection and diffusion of internal charges, low cost, and increasing barrier height

Pending Publication Date: 2020-06-05
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, compared with other materials, polyimide has higher heat resistance (Tg≈360 ° C), and has excellent mechanical properties, radiation resistance and stability, but its sharp increase in high temperature and high electric field Leakage current will cause higher conductance loss, which will eventually lead to a large decrease in its energy storage density
In addition, ordinary aromatic PI itself has a low dielectric constant (about 3.4), and it is difficult to obtain high polarization strength, which cannot meet the needs of electronic devices for miniaturization, light weight and high temperature environment applications.
Although the dielectric parameters of composite materials can be greatly improved by doping ceramic particles with high dielectric constant (such as BT, CCTO, etc.), it also leads to a decrease in breakdown field strength and an increase in dielectric loss, and the performance deterioration at high temperatures is even worse. Serious, not suitable for practical application

Method used

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  • Polyimide dielectric film and preparation method and application thereof
  • Polyimide dielectric film and preparation method and application thereof
  • Polyimide dielectric film and preparation method and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0030] A preparation method of polyimide dielectric film, comprising the following steps:

[0031] S1. Add 20g of N,N-dimethylacetamide (DMAC) into a 50mL three-necked flask;

[0032] S2. Under the protection of inert gas, add 0.01mol of 3,3'-diaminodiphenylsulfone (mDS) into the three-neck flask of step S1, stir vigorously until completely dissolved, and then add 0.011mol of 3,3' -4,4'-biphenyltetracarboxylic dianhydride (BPDA), stirred at 25°C for 12h until completely dissolved, to obtain a stable polyamic acid (PAA) precursor mixed solution with a solid content of 15wt%;

[0033] S3. Put the PAA precursor mixed solution obtained in step S2 into a vacuum oven, and perform vacuum treatment at a temperature of 25° C. to remove excess air bubbles;

[0034] S4. Coat the PAA precursor mixed solution treated in step S3 on a clean glass substrate. The thickness of the coating can be adjusted by the height of the casting blade; heat treatment at 100°C for 60 minutes, and then heat ...

Embodiment 2

[0036] A preparation method of polyimide dielectric film, comprising the following steps:

[0037] S1, add 0.08g Al 2 o 3 Add nano-powder and 20g N,N-dimethylacetamide (DMAC) into a 50mL three-necked flask;

[0038] S2. Under the protection of an inert gas, add 0.01mol of 4,4'-diaminodiphenylsulfone (pDS) into the three-neck flask of step S1, stir vigorously until completely dissolved, and then add 0.011mol of pyromellitic acid Dianhydride (PDMA), stirred at 25°C for 12h until completely dissolved to obtain polyamic acid (PAA) and Al 2 o 3 The precursor mixed solution of the nanopowder, the solid content of the precursor mixed solution is 10wt%;

[0039] S3. Put the precursor mixed solution obtained in step S2 into a vacuum oven, and perform vacuum treatment at a temperature of 25° C. to remove excess air bubbles;

[0040] S4. Coating the precursor mixed solution treated in step S3 on a clean glass substrate; then heat-treating at 100° C. for 60 minutes, at 150° C. for 60...

Embodiment 3

[0042] A preparation method of polyimide dielectric film, comprising the following steps:

[0043] S1. Add 0.09g MgO nanopowder and 20g N,N-dimethylformamide (DMF) into a 50mL three-necked flask, and perform ultrasonic dispersion for 30min;

[0044] S2. Under the protection of an inert gas, add 0.01mol of 4,4'-diaminobenzophenone (4,4'-DABPO) into the three-neck flask of step S1, stir vigorously until completely dissolved, and then add 0.011 mol of 3,3'-4,4'-diphenyl ether tetracarboxylic dianhydride (ODPA), stirred at 25°C for 12h until completely dissolved to obtain a precursor mixture containing polyamic acid (PAA) and MgO nanopowder Solution, the solid content of the precursor mixed solution is 15wt%;

[0045] S3. Put the precursor mixed solution obtained in step S2 into a vacuum oven, and perform vacuum treatment at a temperature of 25° C. to remove excess air bubbles;

[0046] S4. Coating the precursor mixed solution treated in step S3 on a clean glass substrate, heat-...

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Abstract

The invention discloses a polyimide dielectric film and a preparation method and application thereof. The preparation method comprises the following steps: under the protection of inert gas, raw materials of the polyimide dielectric film and a polar organic solvent are mixed and stirred to carry out reactions to obtain a precursor mixed solution, film casting is conducted after defoaming, and a heat treatment is conducted. Raw materials of the polyimide dielectric film comprise an aromatic diamine compound, an aromatic tetra-carboxylic dianhydride compound and nano powder, and the energy bandgap of the nano powder is larger than 4 eV. Or the raw materials of the polyimide dielectric film comprise an aromatic diamine compound II and an aromatic tetra-carboxylic acid dianhydride compound II, and the aromatic diamine compound II and the aromatic tetra-carboxylic acid dianhydride compound II contain at least one of carbonyl, ether bonds, cyano, amido, sulfonyl and methylene. The preparation method of the polyimide dielectric film is simple in process and low in cost, and the prepared polyimide dielectric film has a high dielectric constant, a high energy storage density and high-temperature and high-electric-field stability.

Description

technical field [0001] The invention relates to the technical field of film capacitors, in particular to a polyimide dielectric film and its preparation method and application. Background technique [0002] Dielectric capacitors are a special type of electrical energy storage device because they can release stored energy in a very short time (microsecond level), generating intense power pulses. This capability enables many pulsed power applications such as medical defibrillation, transversely excited atmospheric lasers, and advanced electromagnetic systems where capacitors convert low-power, long-duration inputs to high-power, short-duration outputs. Recently, new types of products related to renewable energy, such as hybrid electric vehicles (HEV), grid-connected photovoltaic power generation, and wind power generators, have created a huge demand for dielectric capacitors. And because these products are often used in high-power, high-current and high-temperature conditions...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08K3/22C08G73/10C08J5/18
CPCC08J5/18C08G73/1067C08G73/1064C08G73/1007C08G73/1071C08J2379/08C08K3/22C08K2201/011C08K2003/2244C08K2003/222C08K2003/2227
Inventor 汪宏董久锋
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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