Preparation method of high temperature-resistant composite polyimide dielectric material

A composite polyimide medium and high temperature resistant technology, which is applied in the field of preparation of high temperature resistant composite polyimide dielectric materials, can solve the problem of high cost and achieve strong practicability, good dielectric properties and easy availability of raw materials Effect

Inactive Publication Date: 2018-08-03
佛山慧创正元新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after 40 years of development, it has not become a larger variety. Th

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] (1) Mix 1 part of copper sulfate, 2 parts of dimethyl sulfoxide, and 1 part of ethanol, add 3 parts of calcium carbonate, 1 part of silicon dioxide, and 1 part of methylparaben, and carry out ultrasonic dispersion after stirring evenly. The ultrasonic power is 250W, ultrasonic 30min, and then the mixture is centrifuged at a centrifugation speed of 3000rpm / min, and the centrifugation time is 10min, the solid precipitate is collected, washed 3 times with distilled water, and dried at 65°C for later use;

[0026] (2) 10 parts of polyimide, 2 parts of polyphenylene sulfide, 4 parts of polylactic acid fiber, 1 part of benzoin dimethyl ether, 1 part of lead magnesium niobate, 2 parts of polyvinyl alcohol, vinyl trimethoxysilane 1 part and the solid mixture of step (1) are put into the vacuum reaction furnace in turn for step-by-step sintering at high temperature in vacuum. The first step is vacuumized and heated to 100-215°C for 30 minutes. The second step is to rapidly heat u...

Embodiment 2

[0033] (1) Mix 2 parts of copper sulfate, 3 parts of dimethyl sulfoxide, and 1 part of ethanol, add 4 parts of calcium carbonate, 2 parts of silicon dioxide, and 1 part of methylparaben, and carry out ultrasonic dispersion after stirring evenly. The ultrasonic power is 250W, ultrasonic 40min, and then the mixture is centrifuged at a centrifugal speed of 4000rpm / min, and the centrifugation time is 12min, the solid precipitate is collected, washed 3 times with distilled water, and dried at 65°C for later use;

[0034] (2) 12 parts of polyimide, 3 parts of polyphenylene sulfide, 5 parts of polylactic acid fiber, 2 parts of benzoin dimethyl ether, 2 parts of lead magnesium niobate, 3 parts of polyvinyl alcohol, 2 parts of vinyl trichlorosilane Parts and the solid mixture of step (1) are sequentially added to the vacuum reaction furnace for step-by-step vacuum high-temperature sintering. The first step is vacuumized and heated to 100-215°C for 30 minutes, and the second step is rapi...

Embodiment 3

[0041] (1) Mix 3 parts of copper sulfate, 3 parts of dimethyl sulfoxide, and 2 parts of ethanol, add 5 parts of calcium carbonate, 3 parts of silicon dioxide, and 2 parts of methylparaben, and carry out ultrasonic dispersion after stirring evenly. The ultrasonic power is 250W, ultrasonic 50min, and then the mixture is centrifuged at a centrifugal speed of 4500rpm / min for 14min, the solid precipitate is collected, washed 3 times with distilled water, and dried at 65°C for later use;

[0042] (2) 14 parts of polyimide, 3 parts of polyphenylene sulfide, 7 parts of polylactic acid fiber, 2 parts of benzoin dimethyl ether, 2 parts of lead magnesium niobate, 4 parts of polyvinyl alcohol, γ-glycidyl ether group 3 parts of propyltrimethoxysilane and the solid mixture of step (1) are sequentially added into the vacuum reaction furnace for step-by-step sintering at high temperature in vacuum. The temperature is rapidly raised to 200-210°C at a rate of 2°C / min, and the pressure is natura...

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PUM

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Abstract

The invention discloses a preparation method of a high temperature-resistant composite polyimide dielectric material. According to the process, raw materials such as copper sulfate, dimethyl sulfone,ethanol, calcium carbonate, silicon dioxide, methyl hydroxybenzoate, polyimide, polyphenylene sulfide, polylactic acid fiber, benzoin dimethyl ether, lead magnesium niobate and polyvinyl alcohol are respectively subjected to the steps such as ultrasonic dispersion, centrifugal washing, drying, stepwise vacuum high temperature reaction, ice bath cooling, pressure banburying, extrusion granulation,molding and packaging to prepare the high temperature-resistant composite polyimide dielectric material. The prepared high temperature-resistant composite polyimide dielectric material is good in hightemperature resistance, anti-aging property and dielectric property, and can meet multiple user needs.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a preparation method of a high-temperature-resistant composite polyimide dielectric material. Background technique [0002] Polyimide is one of the best comprehensive properties of organic polymer materials, with a high temperature resistance of over 400°C, a long-term use temperature range of -200 to 300°C, no obvious melting point, high insulation performance, and a dielectric constant of 4.0 at 103 Hz. The dielectric loss is only 0.004~0.007, belonging to F to H. Application in microelectronic devices: used as a dielectric layer for interlayer insulation, as a buffer layer can reduce stress and improve yield. As a protective layer, it can reduce the influence of the environment on the device, and can also shield the a-particles, reducing or eliminating the soft error (soft error) of the device. As a promising polymer material, polyimide has been fully recognized...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L81/02C08L67/04C08L29/04C08K13/02C08K3/36C08K3/26C08K3/30C08K5/5425
CPCC08K2003/265C08K2003/3045C08L79/08C08L2205/035C08L2205/16C08L81/02C08L67/04C08L29/04C08K13/02C08K3/36C08K3/26C08K3/30C08K5/5425
Inventor 胡玲
Owner 佛山慧创正元新材料科技有限公司
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