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Shoe full set packaging seamless technology

A seamless, complete set of technology, applied in applications, footwear, clothing, etc., can solve the problems of installing the main heel and inner toe cap, and achieve the effects of reducing weight, saving processes, and improving production efficiency

Active Publication Date: 2018-06-15
JIHUA 3513 IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that the warpage transfer needs to be completed through multiple seams during shoemaking, the inside needs to be stitched, and the main heel and inner toe cap need to be installed. The present invention provides a complete bag for shoes without Gap technology, this technology does not need to go through multiple seams to complete the warp transfer when making shoes, no need to sew the inside, no need to install the main heel and inner toe cap

Method used

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  • Shoe full set packaging seamless technology
  • Shoe full set packaging seamless technology
  • Shoe full set packaging seamless technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Such as Figure 1-4 Shown, a kind of shoe is used for a full set of bag seamless technology, comprises the following steps:

[0031] Step 1: Lining the back of the shoe cover 1, glue the side of the shoe cover 1 and the unlined side of the shoe cover 1, and sew the tongue and the shoe cover 1, and remove the stubble on the edge of the shoe tongue after sewing Trim clean;

[0032] Step 2: Punch holes 4 on the shoe cover 1 and the upper circumference 2 respectively. The punching holes 4 on the shoe cover 1 are set on the inside circle of the toe arc of the shoe cover 1. The punching holes 4 on the upper circumference 2 are set on the shoe The inner circle of the toe arc of cover 1;

[0033] Step 3: Sew the back seams 5 on both sides of the heel of the upper circumference 2 on the front of the upper circumference 2;

[0034] Step 4: Sew the back heel and the heel of the upper circumference 2 through two stitches;

[0035] Step 5: 3-pass the catchy strip;

[0036] Step...

Embodiment 2

[0043] Such as Figure 1-3 As shown, on the basis of Example 1, the distance between the edge of the lining in step 1 and the edge in the shoe cover is 12-13 mm, and the distance between the tongue and the shoe cover 1 suture line and the side of the shoe cover 1 is 1.5-1.5 mm. 2.0mm.

[0044] In the step 3, the suture line of the back seam 5 on both sides of the heel of the shoe upper circumference 2 is 51.5-2.0 mm away from the back seam.

[0045] In step 4, the distance between the back heel and the upper circumference 2 of the two sutures is 61.5-2.0mm from the first suture to the back heel marking line, and the second suture is 61.5-2.0 mm from the back heel marking line Print 63.0 ~ 3.5mm.

[0046] In the step 5, the thickness of the through sheet is 1.0mm or 1.1mm.

[0047] In the step 6, one side of the top strip 3 is stitched with the shoe upper circumference 2, and the suture line is located on the side away from the top strip line print 7 away from the shoe upper...

Embodiment 3

[0050] Based on Example 1, both the shoe cover 1 and the shoe upper circumference 2 are made of genuine leather.

[0051] Both the shoe cover 1 and the shoe upper circumference 2 are made of genuine leather, which can increase the air permeability of the sole, greatly improve the comfort of the sole, and make the inner cavity of the shoe dry and transparent. At the same time, the comfort of wearing is improved, and it is suitable for casual and formal occasions and people who have high requirements for shoes, and it relieves the trouble of uncomfortable feet in the shoe cavity.

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Abstract

The invention provides a shoe full set packaging seamless technology. The shoe full set packing seamless technology includes the following steps: a first step, pasting a lining onto a back surface ina shoe cover, gluing a surface of the shoe cover and a lining of the shoe cover together, and sewing a shoe tongue and the shoe cover; a second step, performing punching on the shoe cover and a shoe upper surrounding; a third step, sewing back seams at two sides of a shoe upper surrounding heel on a front surface of the shoe upper surrounding; a fourth step, sewing a back packaged heel and the shoe upper surrounding heel through two sewing threads; a fifth step, thinning an upper opening strip; a sixth step, sewing a part with glue, of the upper opening strip; a seventh step, punching the upper opening strip; an eighth step, sewing the shoe cover and the shoe upper surrounding together through a mark line; and a ninth step, fixing a shoe sole on the bottom of the shoe upper surrounding. The shoe full set packaging seamless technology can complete warping transferring without sewing and jointing a sewing opening, can avoid inner lining sewing, can avoid a main heel and an inner packaging head, can save processes, and can improve the production efficiency.

Description

technical field [0001] The invention relates to the technical field of shoe manufacturing, in particular to a seamless process for a full package of shoes. Background technique [0002] Existing shoes are mainly composed of uppers, uppers, inner soles and soles. The traditional process requires first fixing the inner soles on the last, and then extruding and sticking the uppers around the upper circle through the front upper machine and the middle and rear upper integrated machine. Put it on the insole, then fix the upper and the upper, and finally fix the insole on the sole to complete the production of the whole shoe. Using the above equipment in shoemaking not only increases the production cost, but also is not conducive to environmental protection. The insole needs to be added during the shoe process, which ultimately increases the weight of the shoe. However, in the existing production process, there is no need to use machinery and equipment and increase the insole to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A43B3/00A43B9/02A43B9/12
CPCA43B3/00A43B9/02A43B9/12
Inventor 金渝萍薛华峰谢松军
Owner JIHUA 3513 IND
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