A shape memory epoxy foam

A technology of epoxy foam and memory, applied in the field of functional polymer materials, to achieve the effect of improving heat resistance, good pore structure, and expanding the scope of use

Inactive Publication Date: 2020-05-01
HENAN ACADEMY OF SCI CHEM RES INST CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the research on shape memory epoxy foam reported in the literature mainly focuses on the influence of the density of shape memory epoxy foam and the external temperature on the macroscopic response to deformation, but its mechanical properties still need to be improved and improved.

Method used

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  • A shape memory epoxy foam
  • A shape memory epoxy foam
  • A shape memory epoxy foam

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] (1) Weigh 5.0g E44 type bisphenol A epoxy resin and 2.5g methyl isobutyl ketone in a round bottom flask at room temperature, heat and stir until completely dissolved. Then weigh 4.0g oligomer polyamide 650 and 2.5g methyl isobutyl ketone in a beaker, heat and stir until they are completely dissolved, pour them into a round bottom flask, mix the two and stir evenly, then add 0.75g styrene , 0.15g methyl methacrylate, 0.6g divinylbenzene, 0.01g azobisisobutyronitrile, 1.0g Span 80 and 1.0g hexadecanol were stirred until homogeneous, and placed in a 55°C water bath for pre-curing for 30min for later use.

[0022] (2) Add 0.17g of calcium chloride to 25ml of deionized water, mix well and set aside.

[0023] (3) Add step (2) dropwise to step (1) under mechanical stirring, and control the dropping time for about 8-10 minutes to obtain a milky white emulsion stable system, which is moved to a reaction kettle and placed in a 50 Continue to react in a water bath at ~60°C for 8...

Embodiment 2

[0025] (1) Weigh 5.0g E51 type bisphenol A epoxy resin and 2.8g methyl isobutyl ketone in a round bottom flask at room temperature, heat and stir until completely dissolved. Then weigh 4.5g oligomer polyamide 650 and 3.0g methyl isobutyl ketone in a beaker, heat and stir until they are completely dissolved, pour them into a round bottom flask, mix the two and stir evenly, then add 0.8g styrene , 0.2g methyl methacrylate, 0.5g divinylbenzene, 0.01g azobisisobutyronitrile, 1.5g Span 80 and 2.0g hexadecanol were stirred until homogeneous, and placed in a 55°C water bath for 30min pre-curing for later use.

[0026] (2) Add 0.07g of calcium chloride to 10ml of deionized water, mix well and set aside.

[0027] (3) Under mechanical stirring, use a dropper to add step (2) to step (1), and control the dropping time for about 8-10 minutes to obtain a milky white emulsion stable system, which is moved to the reaction kettle and placed in Continue to react in a water bath at 50-60°C for...

Embodiment 3

[0028] Embodiment 3: comparative example

[0029] (1) Weigh 5.0g E44 type bisphenol A epoxy resin and 2.5g methyl isobutyl ketone in a round bottom flask at room temperature, heat and stir until completely dissolved. Then weigh 4.0g oligomer polyamide 650 and 2.5g methyl isobutyl ketone in a beaker, heat and stir until they are completely dissolved, pour them into a round bottom flask, mix the two and stir evenly, then add 1.0g Span 80. Stir 1.0 g of cetyl alcohol until uniform, place in a water bath at 55°C for 30 minutes for pre-curing and set aside.

[0030] (2) Add 0.17g of calcium chloride to 25ml of deionized water, mix well and set aside.

[0031] (3) Add step (2) dropwise to step (1) under mechanical stirring, and control the dropping time for about 8-10 minutes to obtain a milky white emulsion stable system, which is moved to a reaction kettle and placed in a 50 Continue to react in a water bath at ~60°C for 8~10 hours until the curing reaction is complete, and then...

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Abstract

The invention discloses shape memory epoxy foam, and belongs to the field of functional polymer materials. The material takes a water drop as a dispersion pore forming phase and an epoxy resin, a curing agent, a reinforced monomer and a crosslinking agent as a continuous phase, and the shape memory epoxy foam is prepared through a one-step method under the stable actions of an emulsifier and a co-emulsifier. The interpenetration polymer network type shape memory epoxy foam is prepared for the first time, the preparation method is simple, the compression performance is excellent, the shape memory characteristic is remarkable, and the shape memory epoxy foam has a broad application prospect.

Description

technical field [0001] The invention relates to the field of functional polymer materials, in particular to a shape-memory epoxy foam. Background technique [0002] Shape memory polymer foam (Shape Memory Polymer Foam) has the characteristics of low density, light weight, high compression rate and shape memory effect. It is a newly developed shape memory polymer material and has great potential in the fields of biomedicine and aerospace. application prospects. Among them, the application of shape-memory epoxy foam as an important shape-memory polymer foam in the aerospace field is particularly attractive, and it is a research hotspot in recent years. [0003] At present, the research on shape memory epoxy foam reported in the literature mainly focuses on the influence of the density of shape memory epoxy foam and the external temperature on the macroscopic response to deformation, but its mechanical properties still need to be improved and improved. Therefore, further impr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F283/10C08F212/08C08F220/14C08F212/36C08J9/12C08L51/08
CPCC08F283/10C08J9/125C08J2203/10C08J2351/08C08F212/08C08F220/14C08F212/36
Inventor 王建莉吴立辉袁梦旗王晋郝旭东秦瑜李旭张陆军王金良周晓楠
Owner HENAN ACADEMY OF SCI CHEM RES INST CO LTD
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