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Electronic element installing base die

A technology of electronic components and mounting seats, which is applied in the field of electronic component mounting seat molds, can solve the problems of low overall strength and easy deformation of mounting seats, and achieve the effect of high overall strength and not easy to deform

Inactive Publication Date: 2018-06-29
SHANGHAI LONGLIAN PACKAGING MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This mount is easy to deform and the overall strength is not high

Method used

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  • Electronic element installing base die
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Embodiment Construction

[0017] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations.

[0018] see figure 1 and figure 2 , the electronic component mounting seat mold provided by the present invention includes a bottom plate 100 , a molding table 200 , several baffles 300 and several partition blocks 400 .

[0019] The bottom plate 100 is a rectangular panel, and the forming table 200 can be placed on the upper surface of the bottom plate 100 , which can improve the overall strength of the forming table 200 .

[0020] In addition, a number of wavy heat dissipation strips are provided on the bottom surface of the bottom plate 100 . The heat dissipation strips can improve the heat dissipation efficiency of the bottom plate 100 and also improve the anti-skid performance of the bottom plate 100 .

[0021] The cross-section of the mo...

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PUM

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Abstract

The invention discloses an electronic element installing base die. The electronic element installing base die comprises a bottom plate, a moulding table, a plurality of baffle plates and a plurality of partition blocks, wherein the moulding table is arranged on the upper surface of the bottom plate; the cross section of the moulding table is an isosceles trapezoid; reinforced support panels extendfrom inclined surfaces of the two sides of the moulding table upwards; a plurality of radiating grooves are respectively formed in the two sides of the moulding table; the plurality of the baffle plates are respectively arranged on the upper surface of the moulding table at equal intervals, and the baffle plates which are positioned on the leftmost side and the rightmost side are respectively connected with the reinforced support panels; and at least two partition plates are arranged between every two adjacent baffle plates at equal intervals. The electronic element installing base die is high in overall strength and can be suitable for installing electronic elements of various weight. An installing base moulded by the electronic element installing base die is difficult to deform and is high in overall strength.

Description

technical field [0001] The invention relates to a mounting seat, in particular to a mold for an electronic component mounting seat. Background technique [0002] The electronic component mounting seat formed by the mold of the existing electronic component mounting seat is generally rectangular, and there are several forming grooves inside it, and the electronic components are placed in the forming groove. This mounting seat is easily deformed, and the overall strength is not high. Contents of the invention [0003] In order to solve the above problems, the present invention provides an electronic component mounting seat mold. [0004] To achieve the above object, the technical scheme of the present invention is as follows: [0005] An electronic component mounting seat mold, the electronic component mounting seat mold comprising: [0006] floor; [0007] Forming table, the forming table is arranged on the upper surface of the bottom plate, the cross-section of the for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C33/00B29L31/34
CPCB29C33/00B29L2031/34
Inventor 包永安
Owner SHANGHAI LONGLIAN PACKAGING MATERIALS