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DGS filter, printed circuit board, and filtering device

A printed circuit board and filter device technology, applied in the field of communication, can solve the problems of unsuitable multilayer printed circuit boards and reduced filtering ability of DGS filters, etc.

Active Publication Date: 2018-07-03
HUAWEI TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, for a communication substrate formed by a multilayer printed circuit board (that is, a printed circuit board including multiple wiring layers and multiple ground substrates), if the above-mentioned defective ground structure is only provided on one ground substrate, it may cause If resonance occurs between different grounded substrates, then the filtering capability of the DGS filter will be significantly reduced, that is to say, the current DGS filter is not suitable for multilayer printed circuit boards

Method used

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  • DGS filter, printed circuit board, and filtering device
  • DGS filter, printed circuit board, and filtering device
  • DGS filter, printed circuit board, and filtering device

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Embodiment Construction

[0038] The technical solutions in the embodiments of the present invention will be described in detail below with reference to the drawings in the embodiments of the present invention.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0040] The DGS filter provided by the embodiments of the present invention can be applied to a multilayer printed circuit board, and the multilayer printed circuit board includes at least two reference layers and at least two wiring layers, and each wiring layer corresponds to a A reference layer (or multiple wiring layers may correspond to the s...

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Abstract

The embodiment of the invention, which relates to the field of the communication technology, provides a defected ground structure (DGS) filter, a printed circuit board, and a filtering device so thatthe filtering capability of a DGS filter on a multilayer printed circuit board can be strengthened. The DGS filter being configured to filter a signal transmitted on target routing in a first routinglayer in a printed circuit board is composed of a first reference layer and a target layer that are arranged in opposite. The target layer is a reference layer different from the first reference layerin the printed circuit board or a routing layer different from the first routing layer in the printed circuit board. A DGS pattern is arranged in the first reference layer and is arranged in symmetric distribution by using the vertical projection of the target routing in the first reference layer as a symmetric axis. N ground via holes are formed and penetrate the first reference layer and the target layer; and the first reference layer is communicated with a reference area in the target layer through the N ground via holes.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of communication, and in particular to a DGS filter, a printed circuit board and a filter device. Background technique [0002] At present, the DGS (Defected Ground Structure) filter in the printed circuit board usually etches a ground defect (Defected Ground) with a certain shape on the ground substrate of the wiring layer in the printed circuit board, such as double The structure of C-shaped defects and the structure of U-shaped dumbbell defects can form LC resonance structures by using these defect structures, so as to filter the electrical signals transmitted in the printed circuit board within a certain frequency band. [0003] However, for a communication substrate formed by a multilayer printed circuit board (that is, a printed circuit board including multiple wiring layers and multiple ground substrates), if the above-mentioned defective ground structure is only provided on ...

Claims

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Application Information

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IPC IPC(8): H01P1/20H05K1/16
Inventor 占存辉高先科李慧敏高思平余平放冯学丽刘恩校方劲缨
Owner HUAWEI TECH CO LTD
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