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A rapid upgrade method for photoelectric pod system zynq chip classification packaging

A technology of photoelectric pods and chips, which is applied in the fields of electrical digital data processing, instruments, calculations, etc., can solve the problems such as the long upgrade time of Zynq chip modules, and achieve the effect of reducing the amount of upgrade data and improving upgrade efficiency

Active Publication Date: 2021-11-16
BEIJING HUAHANG RADIO MEASUREMENT & RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to solve the above-mentioned technical problems in the prior art, the present invention proposes a kind of photoelectric pod system Zynq chip graded packaging fast upgrade method, solves the problem that the photoelectric pod system Zynq chip module upgrade time is too long, improves Zynq chip software upgrade efficiency

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  • A rapid upgrade method for photoelectric pod system zynq chip classification packaging

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Embodiment Construction

[0027] The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0028] A kind of graded and packaged quick upgrade method of Zynq chip of photoelectric pod system, such as figure 1 shown, including the following steps:

[0029] Step 1. Generate the photoelectric pod application module.

[0030] The application module realizes the photoelectric pod process control and the function upgrade of the photoelectric pod, and the application module is loaded onto the Zynq hardware platform by an emulator loading mode, and the spatial data corresponding to the application module is exported to generate an application module P_A; The length of the spatial data is greater than the length of the application module, which is a fixed length; the generated application module P_A is assigned the Zynq hardware platform DDR address ADDR_A.

[0031] Step 2, generating a boot module of the Zynq hardware platform, the boo...

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Abstract

The invention relates to a method for rapidly upgrading Zynq chips of a photoelectric pod system by grading and packaging, comprising the steps of: 1. generating a photoelectric pod application module; 2. generating a guide module for a Zynq hardware platform; 3. solidifying the application module and the guide module ; 4. The Zynq hardware platform is powered on and started, and the boot process is run; 5. The application module is upgraded according to an external upgrade instruction. The present invention adds a second-level guide module between the FPGA module and the application module for isolation through hierarchical packaging. In the case of only upgrading the application module, there is no need to upgrade the FPGA module, which greatly reduces the amount of upgrade data and improves the software upgrade efficiency by 90% %above.

Description

technical field [0001] The invention belongs to the technical field of optoelectronics, and in particular relates to a method for rapidly upgrading Zynq chips of an optoelectronic pod system by grading and packaging. Background technique [0002] The current photoelectric pod products use the Zynq chip for target recognition and tracking processing. After the chip is loaded into the photoelectric pod product, generally no JTAG loading port is reserved for external use, so it can only be upgraded online through serial ports. Since the Zynq executable module includes FPGA and application modules, the size of the FPGA module and the application module is quite different. Often the FPGA module reaches about 10MB, and the application module is only about 300KB. The traditional online upgrade method changes the application module but the FPGA module remains unchanged. In some cases, the FPGA module needs to be upgraded online. The amount of upgrade data is large and the transmissi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F8/658
Inventor 万增录于云翔朱小杰张艳辉董诚辰
Owner BEIJING HUAHANG RADIO MEASUREMENT & RES INST