Transformation-based X-ray image BGA (ball grid array) solder ball contour extraction method

A contour extraction and image-based technology, applied in the field of computer software automation, can solve the problems of data subjectivity enhancement, etc., and achieve the effect of enhancing image recognition rate and high adaptability

Active Publication Date: 2018-07-13
UNIV OF ELECTRONIC SCI & TECH OF CHINA
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Moreover, these methods are all dependent on parameters. The adjustment of parameters directly determine

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  • Transformation-based X-ray image BGA (ball grid array) solder ball contour extraction method
  • Transformation-based X-ray image BGA (ball grid array) solder ball contour extraction method
  • Transformation-based X-ray image BGA (ball grid array) solder ball contour extraction method

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Embodiment Construction

[0055]Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0056] In describing the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and It is not to indicate or imply that the device or element referred to...

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Abstract

The invention provides a transformation-based X-ray image BGA (ball grid array) solder ball contour extraction method. The method includes steps: S1, acquiring a solder joint original image, subjecting the original image to circle detection to obtain a solder joint image, and subjecting solder balls of each solder joint to primary recognition to obtain ROI (region of interest) of each solder joint; S2, transforming the original image to obtain a target image, and subjecting the target image to edge detection; S3, mapping a detection result to an original coordinate system to obtain a mask image, and subjecting the original image to mask processing to extract images of single solder joints; subjecting the mask image to edge extraction to obtain a solder joint contour image.

Description

technical field [0001] The invention relates to the field of computer software automation, in particular to a method for extracting the outline of BGA solder balls in X-ray images based on transformation. Background technique [0002] In the prior art, there are mainly three methods for extracting the outline of BGA solder joints on the PCB: [0003] 1. After preprocessing such as noise reduction, perform threshold segmentation to extract BGA solder joints; [0004] 2. Use the flood method to gradually fill the image and the improved "scan line-based seed filling method" to obtain BGA solder joints; [0005] 3. Use Canny and other edge detection methods to identify the edge of the solder joint, so as to obtain the solder ball target. [0006] The first method only uses the grayscale information of the digital image, which requires high grayscale interference and image quality, and is susceptible to interference from internal air bubbles and external wires; the second metho...

Claims

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Application Information

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IPC IPC(8): G06T7/13G06T7/12G06T7/00G06K9/46G06K9/32
CPCG06T7/0004G06T7/12G06T7/13G06T2207/10116G06T2207/30152G06V10/48G06V10/25
Inventor 方黎勇李井元
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA
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