Microassembly method and chip device
A technology of micro-assembly and metallographic microscope, which is applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of high cleanliness, difficult operation, complicated operation, etc., and achieve high assembly efficiency, Interconnecting Simple Effects
Active Publication Date: 2019-09-17
江西华讯方舟智能技术有限公司
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Problems solved by technology
[0004] Based on this, it is necessary to provide a micro-assembly method for the problems that the existing gold wire bonding technology requires high cleanliness on the surface of the bonding position, the operation is relatively complicated, and the operation is difficult, resulting in low efficiency of electronic assembly. and chip device
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[0026] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0027] A micro-assembly method that electrically connects a first object and a second object with a strip of conductive material, that is, interconnects the first object and the second object with a strip of conductive material. Typically, the width of the strips of conductive material is in the range of 75 μm to 300 μm. The conductor material strip with such a width can not only meet the interconnection requirements of the first object and the second object, but also can save space. In this embodiment, the material of the conductive material strip is gold, that is, the conductive material strip is a gold strip. The nature of the gold belt is relatively stable, the electrical conductivity is better, and the service life is longer. In...
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The present invention relates to a micro-assembly method for electrically connecting a first object and a second object with a strip of conductive material. The method includes: measuring the linear distance between the first object and the second object under a metallographic microscope; preparing the conductor material strip according to the linear distance; wherein, the length of the conductor material strip is greater than 15% to 50% of the straight-line distance, the two ends of the conductor material strip are respectively the first end and the second end; the first end of the conductor material strip is welded to the first target, and the A second end of the strip of conductive material is welded to the second target. The invention also relates to a chip arrangement. In the above-mentioned micro-assembly method and chip device, when soldering the two ends of the conductor material strip to the first target and the second target respectively, no additional treatment is required on the surfaces of the first target and the second target and the conductor material strip. Therefore, the interconnection between the first object and the second object is relatively simple, and the assembly efficiency is high.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a micro-assembly method and a chip device. Background technique [0002] Micro-assembly technology performs high-density interconnection of integrated circuit bare chips, thin / thick film hybrid circuits, micro-small surface mount components, etc., to form an advanced electrical interconnection of high-density, multi-functional modular electronic products with a three-dimensional structure. Technology has been more and more widely used in electronics, aviation, aerospace, ships, weapons and other industries. [0003] In the traditional micro-assembly technology, bonding technology is used to bond the conductive material strips on the substrate of the chip to realize the interconnection between bare chips, components or hybrid circuits of integrated circuits. The traditional micro-assembly technology is exemplified by gold wire bonding technology. Before gold wire bonding,...
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IPC IPC(8): H01L21/60H01L23/488
CPCH01L24/40H01L24/84H01L2224/84238H01L2224/78301H01L24/78H01L2224/45144H01L24/45H01L2224/45014H01L2224/45124H01L2224/45147H01L2224/85444H01L2224/48227H01L2224/85181H01L2224/85801H01L24/85H01L2224/78753H01L2224/78313H01L2924/00014H01L24/48H01L2224/05599H01L2224/73221
Inventor 范志敏丁庆马建国张齐军
Owner 江西华讯方舟智能技术有限公司