Terminal plating materials and terminals, wires equipped with terminals, and wire harnesses using the wires
一种端子镀层、镀层的技术,应用在连接装置的零部件、电路、耦合装置等方向,能够解决耐热性不是非常高、锡镀层劣化、锡镀层电阻高等问题
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[0070] Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples.
[0071] First, a pretreatment of the metal substrate as the material to be plated is carried out. Specifically, the metal substrate was cleaned by alkali degreasing, and immersed in 10% sulfuric acid for 2 minutes for acid leaching, followed by cleaning with water. For the metal base, a C1020-H copper plate specified in JIS H3100:2012 (copper and copper alloy sheets, plates, and strips) was used.
[0072] Next, a nickel plating layer is formed on the surface of the metal substrate. Specifically, the pretreated metal substrate was immersed in the plating bath for nickel plating, and a DC stabilized power supply was used at 5A / dm 2 Under the conditions of the current density, the electrolysis time of 30 seconds, and the plating bath temperature of 55°C, it was subjected to constant current e...
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