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Microphone-based structure assembly, and sound box

A microphone and assembly technology, which is applied in the direction of frequency/direction characteristic device, microphone mouth/microphone accessories, etc., can solve the problems of cumbersome assembly, high assembly requirements, blockage of sound pickup channel, etc., and achieve the reduction of difficulty and required Time, high voice recognition ability, and the effect of improving assembly efficiency

Inactive Publication Date: 2018-09-07
PHICOMM (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] (1) There is a cavity inside the sound pickup channel, and the echo generated seriously affects the sound pickup of the microphone and the voice recognition of the smart speaker;
[0007] (2) The opening of the sound pickup channel of the sealing sleeve needs to be aligned with the sound pickup hole of the product shell, and the assembly requirements are high, which may easily cause blockage of the entire sound pickup channel;
[0008] (3) The number of assembly parts is relatively large, the assembly is cumbersome, and the working hours are long, which affects the assembly efficiency

Method used

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  • Microphone-based structure assembly, and sound box
  • Microphone-based structure assembly, and sound box
  • Microphone-based structure assembly, and sound box

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Such as Figure 4 As shown, the microphone-based structural assembly of this embodiment includes a housing 1 , a microphone 3 , a PCB 4 and a base 6 . Such as Figure 5-8 As shown, the housing 1 includes an outer load-bearing layer 11 and an inner sealing and vibration-damping layer 12. The load-bearing layer 11 is a circular pot-shaped structure made of hard materials such as PC, ABS, PVC, etc., to ensure that the entire structure has a certain It can also be used as a connection and fixing structure to connect to the body of the speaker or other products that require this structural assembly. The sealing and damping layer 12 is a ring structure adapted to the structure of the load-bearing layer 11. The material of the sealing and damping layer 12 is soft elastic materials such as TPE and TPU, and the hardness is preferably Shore 40A; the sealing and damping layer 12 The thickness is more than 1mm to ensure a better vibration damping effect. The load-bearing layer 1...

Embodiment 2

[0049] The microphone-based structural assembly of this embodiment is different from Embodiment 1 in that:

[0050] Specifically, several support columns are provided on the inner wall of the base, and the support columns are pressed against the lower surface of the PCB board, so that the PCB board is pushed to move through the support columns, and the space between the base and the inner cavity of the housing can be increased to accommodate other parts.

[0051] For other structures of this embodiment, reference may be made to Embodiment 1.

[0052] The sound box of this embodiment includes a sound box body and the microphone-based structural assembly of this embodiment provided on the sound box body, and has the advantages of the above structural assembly.

Embodiment 3

[0054] The microphone-based structural assembly of this embodiment is different from Embodiment 1 in that:

[0055] Specifically, the number of microphones on the PCB board can also be one, three, five, six, nine, etc., and the number can be adjusted according to actual needs; correspondingly, a pickup equal to the number of microphones is formed on the housing audio channel. The structure diversification of the microphone-based structural assembly is realized, and the user has a high degree of freedom of choice.

[0056] For other structures of this embodiment, reference may be made to Embodiment 1.

[0057] The sound box of this embodiment includes a sound box body and the microphone-based structural assembly of this embodiment provided on the sound box body, and has the advantages of the above structural assembly.

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Abstract

The invention belongs to the technical field of sound collection, and specifically relates to a microphone-based structure assembly, and a sound box. The microphone-based structure assembly comprises:a housing comprising a bearing layer on the outer side and a sealing and damping layer on the inner layer, wherein the bearing layer and the sealing and damping layer are of an integrally formed structure, a through hole is formed in the housing, and the through hole penetrates through the bearing layer and the sealing and damping layer in sequence to form a pickup channel with a first port and asecond port; and a microphone arranged at the second port of the pickup channel and in interference fit with the sealing and damping layer. According to the microphone-based structure assembly provided by the invention, the bearing layer and the sealing and damping layer of the housing are integrated, so that the formed pickup channel has no hollow cavity, in this way, the echo generated by the hollow cavity is eliminated, and the accuracy of voice recognition is improved; and in addition, the assembly step of the sealing and damping component is simplified, and the assembly efficiency of thestructure assembly is improved.

Description

technical field [0001] The invention belongs to the technical field of sound collection, and in particular relates to a microphone-based structural assembly and a sound box. Background technique [0002] With the continuous improvement of the level of science and technology, smart home has developed rapidly; far-field voice control, as the main control method of the smart home control center, is widely used in smart speakers, smart TVs and other products. Among them, the smart speaker usually adopts a microphone array composed of multiple microphones to realize the requirement of localizing the sound source. [0003] Existing microphone arrays can be classified into shell-type microphone arrays and non-shell-type microphone arrays according to different sound pickup structures. Such as figure 1 As shown, the microphone 1' of the shell-type microphone array is assembled and fixed on the shell 2' of the product, and the opening 3' on the shell is used as a sound pickup chann...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/08H04R1/20
CPCH04R1/08H04R1/20
Inventor 黎裕熙
Owner PHICOMM (SHANGHAI) CO LTD
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