A semiconductor chip production process

Abstract

The invention belongs to the technical field of manufacturing of semiconductor chips and particularly relates to a semiconductor chip production technology. The technology comprises following steps ofplacing a wafer on a grinding machine and grinding the wafer into a mirror face; placing the wafer into a high-temperature diffusion furnace for oxidation treatment; coating the surface of the waferwith photoresist and then placing the wafer into a photoetching machine for exposure and development; sending the wafer into an etching machine for plasma etching; sending the wafer into a high-temperature furnace for doping; and transmitting the wafer to the next working procedure. By setting a vibration device under the top plate of a box body, it is achieved that solid products on a reaction surface of the wafer fall off through vibration. By setting a rotating device under the vibration device, rotation of the wafer is achieved, so it is achieved that the reaction face of the wafer is uniformly subjected to bombardment of ions, and processing quality of the wafer is improved. By setting a suction plate on an optical rod, it is achieved that reaction products generated on the reaction surface of the wafer are removed and reaction efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor chip manufacturing, in particular to a semiconductor chip production process. Background technique [0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Wafer is the carrier used in the production of integrated circuits. In general, wafers refer to single crystal silicon wafers. Wafer is the most commonly used semiconductor material. According to its diameter, it is divided into 4 inches, 5 inches, 6 inches, 8 inches and other specifications. Recently, 12 inches or even larger specifications have been developed. The larger the wafer, the more ICs that can be produced on the same wafer, which can reduce costs; but the requirements for material technology and production technology are higher, such as uniformity and so on. It is generally believed that the larger the diameter of the silicon wafer, it means that the fab has better technol...

AI Technical Summary

Problems solved by technology

[0004] The etching method of this technical solution realizes sustainable etching regardless of the volatility of the etching reaction product, but the reaction product generated on the wafer etching reaction surface cannot be eliminated in time, which hinders the progress of new reactions, and then The reaction efficiency is affected; the reaction gas injection is too concentrated, and the ionized ions are too concentrated to bombard the local area of ​​the wafer, resulting in uneven etching of the reaction surface and affecting the quality of wafer processing

Images