Cover strip structure

A cover tape, integrated technology, applied in packaging and other directions, can solve problems such as unfavorable operation of electronic components, easily damaged electronic components, electronic components shake out, etc., to achieve uniform peel strength, stable peel strength, and peel strength temperature. Effect

Pending Publication Date: 2018-09-28
广州市中载电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the surface roughness of the carrier tape is difficult to control during production, after the cover tape and the carrier tape are bonded together by an adhesive, when the cover tape needs to be peeled off, the peel strength of the bonded part of the cover tape and the carrier tape cannot be controlled. , the peeling strength is very unstable. When the peeling strength is high, the peeling will cause vibration, which will cause the carrier tape to drive the electronic components to move, or when the vibration is large, the electronic components will be shaken out of the carrier tape. , which is very unfavorable for the subsequent removal of electronic components, and it is easy to damage electronic components

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] The above-mentioned cover tape structure is adopted, wherein, the material of the base film layer 1 in the surface layer is PET, and the thickness is 30 μm, and the material of the base film layer 1 in the middle layer is EVA, and the thickness is 15 μm, and the first adhesive layer 2 It is a pressure-sensitive adhesive, and the second adhesive layer 3 is a heat-sensitive adhesive.

[0016] The cover tape in Example 1 and the carrier tapes of the three materials in Table 1 were respectively sealed under the same sealing conditions by the sealing instrument VANGUARD SYSTEMS VN-1100, and then tested by the peel force testing instrument VANGUARD SYSTEMS VG-20. Peel the cover tape under the same peeling conditions, and the test results shown in Table 1 can be obtained. Among them, the range value of the fluctuation range of the peeling force is controlled at 0g

Embodiment 2

[0022] On the basis of Example 1, the material of the base film layer 1 of the intermediate layer was changed to PE, and the rest of the content was the same as that of Example 1. The test results are shown in Table 2.

[0023] Table 2

[0024]

Embodiment 3

[0026] On the basis of Example 1, the material of the base film layer 1 of the middle layer was changed to PP, and the material of the first adhesive layer 1 was changed to a heat-sensitive adhesive. The rest of the content was the same as that of Example 1. The test results as shown in Table 3.

[0027] table 3

[0028]

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PUM

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Abstract

The invention discloses cover strip structure. The cover strip structure comprises two substrate film layers; the two substrate film layers are connected as a whole through a first adhesive layer; a second adhesive layer is arranged on the surface, without the first adhesive layer, of the first substrate film layer; two symmetric incisions are arranged on the second adhesive layer in the length direction; and the depths of the incisions extend from the second adhesive layer into the substrate film layer connected with the second adhesive layer. The cover strip structure achieves stable and uniform stripping strength.

Description

technical field [0001] The invention relates to a cover tape structure for covering on a carrier tape carrying electronic components. Background technique [0002] During the storage and transportation of electronic components, it is often necessary to use the cooperation of the carrier tape and the cover tape to seal and transport the electronic components. The cover tape is directly adhered to the surface of the carrier tape through the adhesive. For components, it is necessary to peel the cover tape off the carrier tape first to expose the electronic components, so that it is convenient to remove the electronic components from the carrier tape manually or by using vacuum nozzles and other instruments. However, since the surface roughness of the carrier tape is difficult to control during production, after the cover tape and the carrier tape are bonded together by an adhesive, when the cover tape needs to be peeled off, the peel strength of the bonded part of the cover tap...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D73/02B65D85/86
CPCB65D73/02B65D2585/86
Inventor 刘兴乐
Owner 广州市中载电子科技有限公司
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