The invention discloses the technical field of 
chip cutting protection films, and particularly relates to an antistatic 
semiconductor chip cutting protection film. The protection film comprises an antistatic release 
coating, a PVC blue film, a blue film protection base 
coating and an antistatic 
acrylic adhesive layer, and has the advantages of good flexibility, high 
temperature resistance, easiness in 
wafer expansion and 
wafer cutting, and capability of eliminating 
static electricity generated by friction in 
wafer expansion and cutting; the arrangement of the blue film protection prime coat can prevent a 
plasticizer in the PVC blue film from being separated out and permeating into the 
adhesive layer to a certain extent, the high 
temperature resistance and 
solvent resistance of the PVC blue film are improved, the PVC blue film is not prone to shrinkage, and the antistatic 
acrylic adhesive layer is stable in peel strength, resistant to high temperature of 180 DEG C and antistatic. And the PVC blue film can be used for striking and effectively identifying the protective film, so the use is convenient. The 
total thickness of the protective film is 80 + / -2 [mu]m, the peel strength is 100 + / -20 gf / inch, no 
adhesive is left, the antistatic resistance value is 106-109 
omega, and the release force is 20 gf / inch.