Epoxy adhesive and application thereof

An epoxy adhesive, epoxy resin technology, applied in the direction of adhesive, epoxy resin glue, novolac epoxy resin adhesive, etc., can solve the problem of high etching solution processing cost, large pollution, and reduced product performance and service life and other problems, to achieve the effect of improving product stability and production efficiency, reducing production costs, and stabilizing peel strength

Inactive Publication Date: 2019-11-15
西安航天三沃化学有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the manufacturing process, the materials of the two conductive layers need to be etched separately, and then hot-pressed and laminated with the insulating protection materials on both sides respectively. Using this process will cause the conductive layer and the insulating layer on one side to undergo repeated acid and alkali corrosion. and high-temperature baking, which reduces product performance and service life, low production efficiency, high cost, and large pollution
[0003] This patent is mainly aimed at solving the problems of high energy consumption, long cycle time, high cost of etching liquid treatment, and non-compliance with environmental protection requirements in the production process of FPC light strips, so as to develop a carrier circuit material for FPC light strips without etching process

Method used

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  • Epoxy adhesive and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] An epoxy adhesive made from:

[0022] 10 parts of polyester carboxyl-containing polyurethane, 10 parts of hydroxyl-terminated polyphenylene ether, 70 parts of phenolic novolac epoxy resin, 20 parts of bisphenol A novolac epoxy resin, 10 parts of phosphorus-containing epoxy resin, phosphate oligomer 15 parts, 20 parts silicon dioxide, 30 parts magnesium oxide, 3 parts dicyandiamide, 42 parts methyl ethyl ketone.

[0023] The preparation method is as follows:

[0024] Step 1: Mix 10 parts of polyester-type carboxyl-containing polyurethane, 10 parts of hydroxyl-terminated polyphenylene ether, 70 parts of phenol-type novolac epoxy resin, 20 parts of bisphenol A-type novolac epoxy resin, and 10 parts of phosphorus-containing epoxy resin. Put 10 parts of ketone in a high-dispersion mixing tank and stir for 2 hours;

[0025] Step 2: Mix and stir the mixture obtained in Step 1 with 15 parts of phosphate oligomer, 20 parts of silicon dioxide, 30 parts of magnesium oxide and 30...

Embodiment 2

[0034] An epoxy adhesive made from:

[0035] Polyether-type carboxyl-containing polyurethane 25 parts, epoxy-terminated polyphenylene ether 5 parts, bisphenol A novolac epoxy resin 50 parts, phosphorus-containing epoxy resin 30 parts, phosphate ester oligomer 5 parts, aluminum hydroxide 60 parts parts, magnesium oxide 20 parts, phthalic anhydride 10 parts, butanone 43 parts.

[0036] The preparation method is as follows:

[0037] Step 1: Put 25 parts of polyether-type carboxyl-containing polyurethane, 5 parts of epoxy-terminated polyphenylene ether, 50 parts of bisphenol A novolac epoxy resin, 30 parts of phosphorus-containing epoxy resin, and 8 parts of methyl ethyl ketone in a high dispersion Stir in the mixing tank for 1h;

[0038] Step 2: Mix and stir the mixture obtained in Step 1 with 5 parts of phosphate oligomer, 60 parts of aluminum hydroxide, 20 parts of magnesium oxide and 30 parts of butanone for 3 hours;

[0039] Step 3: Mix and stir the mixture obtained in Ste...

Embodiment 3

[0047] An epoxy adhesive made from:

[0048] 20 parts of polyester carboxyl-containing polyurethane, 20 parts of polyether carboxyl-containing polyurethane, 15 parts of hydroxyl-terminated polyphenylene ether, 75 parts of biphenyl epoxy resin, 45 parts of phosphorus-containing epoxy resin, and 5 parts of phosphate oligomer , 50 parts of silicon dioxide, 50 parts of aluminum hydroxide, 3.6 parts of diethylenetriamine, 1.8 parts of m-phenylenediamine, and 42 parts of butanone.

[0049] The preparation method is as follows:

[0050] Step 1: Mix 20 parts of polyester-type carboxyl-containing polyurethane, 20 parts of polyether-type carboxyl-containing polyurethane, 15 parts of hydroxyl-terminated polyphenylene ether, 75 parts of biphenyl-type epoxy resin, 45 parts of phosphorus-containing epoxy resin, and 10 parts of butanone Parts were placed in a high-dispersion mixing tank and stirred for 2 hours;

[0051] Step 2: Mix and stir the mixture obtained in Step 1 with 5 parts of ph...

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Abstract

The invention discloses an epoxy adhesive and an application thereof. The purpose of the invention is to solve the problems of high energy consumption, long cycle, high etching liquid processing costand incompatibility with the environmental protection requirement in the production process of existing FPC lamp strips. The epoxy adhesive includes a polyurethane, a polyphenylene ether, an epoxy resin, a curing agent, a flame retardant, a filler and a solvent. A technology for preparing a PET cover film from the epoxy adhesive concretely comprises the following steps: uniformly coating one sideof an electric insulating film with the epoxy adhesive, allowing the electric insulating film coated with the adhesive to go through a drying oven in order to remove a solvent and dry the electric insulating film, performing rolling re-laminating the electric insulating film with a semi-cured adhesive layer to a release material, and finally aging the obtained product to obtain the PET cover film.The epoxy adhesive prepared in the invention and the PET cover film using the adhesive have a low release force and a stable peeling strength, can be used for preparing non-etched LED circuit boards,have a low production cost, and are green and environmentally friendly.

Description

technical field [0001] The invention belongs to the technical field of electronic component material preparation, and in particular relates to an epoxy adhesive and its application. Background technique [0002] With the development of LED lighting technology, the application fields of flexible LED lighting materials are becoming more and more extensive. Flexible LED light strips generally include a five-layer structure, including insulating materials on both sides of the outermost sides, two conductive layers in the middle, and a central insulating layer that isolates the two conductive layers. The production process of LED light strip is the conventional production process of FPC with etching. Therefore, in the manufacturing process, the materials of the two conductive layers need to be etched separately, and then hot-pressed and laminated with the insulating protection materials on both sides respectively. Using this process will cause the conductive layer and the insula...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/04C09J175/08C09J171/12C09J163/00C09J11/06C09J11/04C09J7/30C09J7/25
CPCC08K2003/222C08K2003/2227C08L2203/20C08L2205/02C08L2205/035C09J11/04C09J11/06C09J163/04C09J2463/00C09J2467/006C09J7/255C09J7/30C09J2301/122C09J2301/408C08L75/08C08L71/12C08L63/00C08K13/02C08K3/22C08K3/36
Inventor 罗保燕莎卢亢朱江花马荔高建宾郭茜王培
Owner 西安航天三沃化学有限公司
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