High-temperature-resistant composite release film

Abstract

The invention discloses a high-temperature-resistant composite release film, which comprises a release film layer, an adhesive layer and a high-temperature-resistant resin film layer, wherein the release film layer is obtained by co-extrusion process of two thermoplastic resin materials; the adhesive layer is formed by coating one surface of the release film layer with an adhesive; and the high-temperature-resistant resin film layer is glued on the adhesive layer. The three-layer high-temperature-resistant composite release film has a compact structure and is easy to peel off. On the basis of not influencing characteristics of rubber surface, release force is low. A fluorine-containing material is selected for the high-temperature-resistant resin film layer. At the high temperature of 200 DEG C, the high-temperature-resistant resin film layer can never be decomposed or react with the release layer or the adhesive layer. The release film has excellent anti-sticking and isolation effects, and has dimensional stability at high temperature. The release layer adopts an organosilicon elastomer adhesive and the thickness is controlled. Then, there is no residue on the release layer.

Description

technical field [0001] The present invention relates to the field of membrane materials. More specifically, the present invention relates to a high temperature resistant composite release film. Background technique [0002] With the development of human civilization and the advancement of science and technology, more and more electronic products are used in various fields of society, and the strategic transfer of foreign electronics industry to foreign countries and the rapid development of domestic communications and electronics industries have made the semiconductor industry and the environment The oxygen copper clad laminate industry is in a golden period of development, and will also drive the rapid development of its accompanying industrial chain. In the manufacture of printed circuit boards, ceramic electronic components, thermosetting resin products, decorative panels, etc., the release film is often used between the metal plates or between the resins in the process ...

AI Technical Summary

Problems solved by technology

Moreover, fluorine release resin has high heat resistance, no deformation and low hygroscopicity, which is very suitable for manufacturing film or sheet-like laminates through high temperature and high pressure forming, but the price is expensive

Products coated with silicone oil on PET or other substrates are prone to residues of silicone oil, resulting in instability and high scrap rates in later use

[0004] At present, my country's domestic communications and electronics industries are developing rapidly, and the semiconductor and epoxy copper-clad laminate industries are in a golden period of development. The demand for high-temperature-resistant composite release films is increasing. Not very mature, most of them rely on foreign imports and expensive raw materials, there is a problem of high cost of fluororesin release film, so that fluororesin release film cannot be popularized in the manufacturing process of electronic products, so the cost of release film is reduced Technology research and localized mass production are imminent

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