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175results about How to "Reduce release force" patented technology

High speed pressing and forming method of warm powder and device thereof

InactiveCN101745638AIncrease the speed of warm pressingPromote particle rearrangementShock waveIntegrated technology
The invention discloses a high speed pressing and forming method of warm powder and a device thereof. The method is an integrated technology of warm-pressing as well as high speed pressing and forming, takes the gravitational potential energy of a drop hammer as pressing energy, a punch hammer falls down to impact on an upper punch to transfer the energy to the powder so as to rapidly and densely form the powder. The punch hammer rope of the device for carrying out the method is connected with a motor by a pulley installed above a guide cylinder and is kept to freely and vertically move in the guide cylinder; a speedometer is symmetrically installed on the two sides of a side die plate; a heating ring is directly sleeved on a die; a pressure sensor is contacted with the lower die punch and is connected with a data acquisition card; and the data acquisition card is connected with a computer by a USB interface. The pressing graph of a shock wave is displayed on the computer, and the maximum value of an impact force and the time impacting on the powder can be directly read from the graphs; and the invention has simple structure, convenient use, reliability and practicability as well as relative low price, is particularly suitable for colleges and universities as well as research and development institutions.
Owner:SOUTH CHINA UNIV OF TECH

Reel-to-reel hot roller coining forming method for micro-nano structure on surface of polymer

InactiveCN106113479AAccelerate filling flowReduce apparent viscosityMicro nanoPolymeric surface
The invention relates to a reel-to-reel hot roller coining forming method for a micro-nano structure on the surface of polymer. The reel-to-reel hot roller coining forming method comprises the steps that a polymer material is conveyed to a preheat roller from an unreeling device, preheated to the attaching temperature and attached to a base band in a hot pressing mode; the polymer material attached to the base band is conveyed to the position between a mold roller and a pressure roller and heated to the coining temperature through the mold roller heated in advance, and then a mold cavity is filled with the polymer material through the action of the pressure roller; mold filling and supersonic vibration assembly starting are conducted at the same time, and the reel-to-reel hot roller coining process is completed with assistance of supersonic vibration; the polymer material is conveyed out from the position between the mold roller and the pressure roller, and then cooled and separated from the position inside the mold roller; and after demolding is completed, a polymer product is continuously cooled, separation of the polymer product and the base band is achieved, and finally reeling is conducted. According to the reel-to-reel hot roller coining forming method for the micro-nano structure on the surface of the polymer, the reel-to-reel hot roller coining process is improved through supersonic vibration, the mold filling process is accelerated, the duplication precision is improved, and the demolding force and demolding deformation are reduced; and the reel-to-reel hot roller coining forming method is advanced.
Owner:SHANGHAI JIAO TONG UNIV

Double-pawl automobile door clock mechanism

ActiveCN105863408AImprove lock strengthImprove the sound of opening and closing doorsNoise-prevention/anti-rattling lockingMechanical engineeringEngineering
The invention discloses a double-pawl automobile door clock mechanism which comprises a base plate, a clamping plate, a first pawl, a second pawl, a first pawl reset spring and a second pawl reset spring. The clamping plate, the first pawl and the second pawl are installed on the base plate and can rotate around a first axis, a second axis and a third axis respectively. The clamping plate is provided with a U-shaped clamping groove capable of being clamped to an automobile body locking pin. The clamping plate is provided with a circular arc face located on the side of the U-shaped clamping groove. The circular arc face is provided with a semi-locking meshed position and a full-locking meshed position. The first pawl is provided with a first extending arm, a second extending arm and a third extending arm which are extended in an integrated mode. The second pawl is provided with a meshed arm capable of abutting against and being separated from the circular arc face and capable of being positioned to the semi-locking meshed position. The first extending arm abuts against the circular arc face and can be positioned on the full-locking meshed position. The first pawl reset spring and the second pawl reset spring are in elastic abutting connection with the first pawl and the second pawl respectively. The second pawl is provided with a protrusion. The second extending arm can be movably located on the two sides of the protrusion. The door lock release force is reduced, and door opening and closing sound is lowered.
Owner:MAGNA AUTOMOTIVE PARTS (SUZHOU) CO LTD

Method for Producing Bonds

The invention relates to a method for producing a bonding of two substrates of which at least one is transparent and of which at least one has a surface having a surface energy (measured according to test method C) of 40 mN/m at maximum, comprising the use off a double-sided adhesive product having a first and a second adhesive surface, wherein the first adhesive surface is covered by a first separating layer and the second adhesive surface is covered by a second separating layer, wherein the pull-off force of the first separating layer from the first adhesive surface, AZK1, is less than the pull-off force of the second separating layer from the second adhesive surface, AZK2, and wherein the ratio of adhesion force of the fresh bond of the first adhesive surface on a surface having a surface energy (measured according to test method C) of 40 mN/m at maximum (KKfresh, measured according to test method B) to the pull-off force (measured according to test method A) of the second separating layer from the second adhesive surface, KKfresh: AZK2, equals at least 13.5, comprising the following step: (a) removing the first separating layer from the first adhesive surface and bringing the first adhesive surface into contact with the surface having a surface energy (measured according to test method C) of 40 mN/m at maximum.
Owner:TESA SE

Device and method for nanoimprinting of full wafer

The invention relates to a device and a method for nanoimprinting of a full wafer, comprising a working platform, a full wafer coated with an etchant resist, a nozzle for demoulding, a template, an imprinting head, a pressure pipeline, a vacuum pipeline and an ultraviolet light source, wherein the template is fixed on the bottom surface of the imprinting head; the side surface on the lower part of the template is equipped with the nozzle for demoulding; the pressure pipeline and the vacuum pipeline are connected to air inlet holes which are arranged on two side surfaces of the working platform of the imprinting head; the full wafer coated with the etchant resist is fixed on a wafer working platform; and the ultraviolet light source is arranged over the imprinting head. The method providedby the invention comprises the following steps of: 1) pre-treating process; 2) imprinting process; 3) curing process; and 4) demoulding process. The device and the method for nanoimprinting of the full wafer provided by the invention have the characteristics that the structure is simple, the cost is low, the production efficiency is high, the accuracy is high, the imprinting area is large, and the suitability for the batch production and the imprinting of the full uneven wafer can be obtained. The device and the method can be applied to the large-scale manufacturing of high-density disc, micro-optic device and micro-fluidic device and the like, and the device and the method are particularly suitable for the imaging of the full wafer of a photonic crystal LED (Light Emitting Diode).
Owner:QINGDAO TECHNOLOGICAL UNIVERSITY
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