Demolding method in nanoimprint technology process
A nano-imprinting and technical technology, applied in the field of micro-nano processing, can solve the problems of tearing and demolding force, deformation of nano-imprinting structure, etc.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2016-02-10
- Estimated Expiration
- Not applicable · inactive patent
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Figure 1
Abstract
Description
technical field
[0001] The invention relates to a demoulding method in the process of nano-imprint technology, which belongs to the field of micro-nano processing. Background technique
[0002] Nanoimprint technology was first proposed in the mid-1990s by Professor Stephen Y. Chou of the Nanostructure Lab of Princeton University in the United States, aiming at the disadvantage of the traditional photolithography process being limited by the exposure wavelength and unable to obtain a smaller size. Due to its low cost, high resolution, simple process and other advantages, this technology has attracted extensive attention of researchers from all over the world. At present, it has been successfully demonstrated that nanoimprinting technology can obtain feature structures with a minimum size of 5nm. This technology is widely used in optics, electronics, biology and many other fields, and is known as one of the top ten technologies that can change the world.
[0003] Nanoimprint...
Examples
Embodiment Construction
[0014] The present invention will be further described below in conjunction with the accompanying drawings.
[0015] The present invention takes ultrasonic-assisted demoulding in the process of nano hot embossing technology as a specific embodiment.
[0016] see figure 1 As shown, an ultrasonic-assisted demoulding method in the process of nano-hot embossing technology, firstly, the nano-imprint polymer is coated on the substrate, heated to melt and soften, and the embossed adhesive layer 3 is formed; then the template 2 Press into the embossed adhesive layer 3; after the embossed adhesive layer 3 is cured and shaped, use the ultrasonic emission device 1 on the upper part of the template 2 to emit ultrasonic waves to the template 2 to assist the separation of the template 2 and the formed embossed adhesive layer 3, and remove the template 2. Complete the demoulding process.
[0017] The ultrasonic waves emitted by the ultrasonic emitting device 1 on the upper part of the temp...