Cover tape

一种盖带、热塑性树脂的技术，应用在挠性覆盖物、包装物品类型、特殊包装物件等方向，能够解决盖带透明度降低等问题，达到透明度优良、稳定剥离强度、抑制飞出的效果

Active Publication Date: 2013-03-13
DENKA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] According to this requirement, there is a proposal of a transparent cover tape (refer to Patent Document 8), but due to the purpose of anti-static, larger particles such as tin oxide and zinc oxide are added to the heat-sealing layer. Conductive particles, thus reducing the transparency of the cover tape, and the haze value mostly exceeds 20%, so a cover tape with higher transparency is required

Method used

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Examples

Experimental program
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Effect test

Embodiment 1）

[0106] [(a-1)m-LLDPE] polymerized by a metallocene catalyst was used as the raw resin, and the resin raw material was stirred at 200°C using a single-screw extruder with a diameter of 40mm, and passed through a T-die at a rate of 20m per minute. Extrude at a linear speed to obtain an interlayer film with a thickness of 40 m. On the surface of a biaxially stretched polyester film with a thickness of 12 μm, a polyester-based primer was coated by gravure printing, and the above-mentioned intermediate layer film [(a-1)m-LLDPE] was pasted to obtain a biaxially stretched polyester film. A laminated film formed of an axially stretched polyester layer and an m-LLDPE layer. Next, after corona treatment was performed on the m-LLDPE surface of the film, [(c-1) resin] dissolved in cyclohexane was applied to the corona-treated surface by gravure printing, so that This became a peeling layer with a dry thickness of 0.8 µm. Furthermore, as a heat seal layer, a random copolymer of butyl met...

Embodiment 2）

[0108] As shown in Table 1, the (c-14) conductive material was mixed into the peeling layer, and 400 parts by mass was mixed with respect to 100 parts by mass of the resin. Except for the mixing ratio and composition shown in Table 1, it was the same as Example 1, and a cover was produced. bring.

Embodiment 3～9、 comparative example 2～10

[0110] A cover tape was produced in the same manner as in Example 1, except that materials such as resins shown in Table 1 and Table 2 were used to form the intermediate layer, release layer, and heat-sealing layer.

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Abstract

Disclosed is a cover tape which comprises at least a base layer (A), an intermediate layer (B), a peeling layer (C), the primary component of which is a thermoplastic resin, and a heat seal layer (D), the primary component of which is a thermoplastic resin that can be heat sealed to a carrier tape. The tensile storage modulus (c) of the thermoplastic resin that constitutes the peeling layer (C) is within the range of 1*106 Pa to 1*108 Pa. The tensile storage modulus (d) of the thermoplastic resin that constitutes the heat seal layer (D) is within the range of 1*108 Pa to 1*10<10> Pa. The ratio of (c) and (d) satisfies 1*104>=(d) / (c)>=1*10. This kind of cover tape has the appropriate peel strength and sufficiently low fluctuation in peel strength when heat sealed to a thermoplastic resin carrier tape. Therefore, the tape will not tear even under shock caused by high-speed peeling, and adherence of electronic parts does not occur even when set aside for a long period of time of 24 to 72 hours in a high-temperature environment of 60 to 80 C.

Description

technical field [0001] The present invention relates to a cover tape for packaging of electronic components. Background technique [0002] Along with the miniaturization of electronic equipment, electronic components used are also becoming smaller and higher in performance, and electronic components are automatically mounted on printed circuit boards in the assembly process of electronic equipment. Electronic components for surface mounting may be stored on a carrier tape on which storage pockets embossed according to the shape of the electronic components are continuously formed. After the electronic components are housed, a cover tape as a covering material is stacked on top of the carrier tape, and both ends of the cover tape are continuously heat-sealed in the longitudinal direction with a heated sealing bar to form a package. As a material for the cover tape, a biaxially stretched polyester film is used as a base material, and a laminate or the like of a heat seal laye...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D73/02B32B27/18B32B27/32B65D65/02B65D85/38
CPCB32B27/308B32B27/30B32B27/28B32B27/08B32B27/36B32B27/32Y10T428/31504Y10T428/31786Y10T428/31855Y10T428/31935B32B27/18B65D65/02B65D73/02B65D85/38
Inventor 佐佐木彰德永久次藤村彻夫
Owner DENKA CO LTD
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