A bonding impedance detection system and method

A technology of impedance detection and bonding, which is applied in the direction of measuring resistance/reactance/impedance, measuring devices, measuring electrical variables, etc. It can solve the problems of large influence on display effect and inability to automatically detect the uniformity of bonding impedance, etc.

Active Publication Date: 2021-04-13
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

It is impossible to automatically detect the bonding impedance and its uniformity, so that the abnormal bonding impedance has a greater impact on the display effect

Method used

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  • A bonding impedance detection system and method
  • A bonding impedance detection system and method
  • A bonding impedance detection system and method

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Embodiment Construction

[0035] In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution in the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, and Not all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0036] figure 1 It is a schematic structural diagram of a bonding impedance detection system provided in Embodiment 1 of the present invention, as shown in figure 1 As shown, the bonding impedance detection system includes a bonding impedance detection module 1, a display panel 2, a chip-on-chip film 3 and a circuit board 4, and the chip-on-chip film 3 and the circuit board 4 pass through a plurali...

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Abstract

The invention discloses a bonding impedance detection system and method. The bonding impedance detection system includes a bonding impedance detection module, a display panel, a chip-on-chip film and a circuit board, and the chip-on-chip film and the circuit board pass through a plurality of The bonding pad group is connected, the COF and the display panel are connected through a plurality of bonding pad groups, the bonding pad group includes two connected bonding pads, part of the bonding pad group A detection structure is formed with the connected first equivalent resistance, the detection structure is connected to the bonding impedance detection module, and the bonding impedance detection module is used to detect the bonding pad group according to the detection structure bonding impedance and uniformity of bonding impedance of the bonding pad set. The invention can detect the bonding impedance of the display screen and the uniformity of the bonding impedance, and effectively reduce the influence of abnormal bonding impedance on the display effect of the display screen.

Description

technical field [0001] The invention relates to the field of display panels, in particular to a bonding impedance detection system and method. Background technique [0002] In the production process of the display screen, such as OLED (Organic Light-Emitting Diode, organic light-emitting diode) display production process, FPC (Flexible Printed Circuit, flexible circuit board) and COF (Chip OnFlex, or, Chip On Film, Chip-on-chip film) and the connection between COF and display panel are all realized by bonding process. Specifically, the bonding process uses ACF glue (Anisotropic Conductive Film, anisotropic conductive film) to connect FPC and COF and COF and display panel. Connect together through corresponding PAD (pad in printed circuit board). The number of particles of the ACF glue, the temperature and time of the bonding connection, the material of the ACF glue, and the cleanliness of the PAD will all cause changes in the bonding impedance. [0003] With the accelerati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R27/02
CPCG01R27/02
Inventor 张斌陈鹏名许文鹏
Owner BOE TECH GRP CO LTD
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