Evaluation method and evaluation system of crystal grain uniformity applied to PCB (printed circuit board) board

Abstract

The invention discloses an evaluation method and an evaluation system of crystal grain uniformity applied to a PCB (printed circuit board) board. The evaluation method of grain uniformity applied to the PCB board comprises the following steps: acquiring a SEM (scanning electron microscope) image of copper to be detected at a preset magnification; selecting a plurality of crystal grains with the maximum average diameter in the SEM image, marking as the abnormal crystal grains, calculating an average value of the average diameter of all the abnormal crystal grains, and calculating an actual maximum diameter value of the crystal grains in the SEM image according to the magnification ratio of the SEM image and the diameter of the abnormal crystal grains; marking the remaining crystal grains after removing the abnormal crystal grains in the SEM image as normal grains, calculating an actual average diameter value of the normal crystal grains in the SEM image, and marking as the actual average diameter value of the crystal grains; calculating a ratio of the actual maximum diameter value Dmax of the crystal grains to the actual average diameter value Daver of the crystal grains, and recording as an uniformity factor V, and determining whether the uniformity factor V is greater than a preset value. The evaluation method of grain uniformity applied to the PCB board improves the calculation accuracy of the uniformity factor.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to an evaluation method and evaluation system for the uniformity of crystal grains applied to PCB boards. Background technique [0002] As the commercialization of 5G communication technology is approaching, the preparatory work of the world's major communication equipment manufacturers and telecom operators has entered the fast lane, and electronic products around 5G tend to develop in the direction of light, thin, short and small. [0003] At present, the copper thinning process is widely used in the industry to reduce the thickness of surface copper to realize the production of fine lines. In actual production, pinholes will appear on the copper surface of the PCB (printed circuit board) after copper electroplating and copper reduction, so that the fine circuit has quality defects such as conduction loss and open circuit. ) The worse the grain uniformity, the higher the ris...

AI Technical Summary

Problems solved by technology

In actual production, pinholes will appear on the copper surface of the PCB (printed circuit board) after copper electroplating and copper reduction, so that the fine circuit has quality defects such as conduction loss and open circuit. ) The worse the grain uniformity, the higher the risk of pinholes. However, the accuracy of the existing evaluation methods is low, and it is difficult to provide a reference for the pinhole problem after copper reduction on the PCB board.

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