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Methods used to establish bonded connections

A bonding connection and bonding technology, used in non-printed jumper connections, printed circuits, printed circuit manufacturing, etc., can solve problems such as inability to find designs, costs, and inability to maintain insulation spacing.

Active Publication Date: 2021-10-01
ZKW GRP GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the bond wire is tensioned over a wide run, it may not be possible to maintain the minimum required insulation spacing relative to the structural or mechanical part
If a large number of bonding wires with complex geometries are used in the layout, it is almost impossible to find a suitable design for the tensioned bonding wires
[0005] Such supports are known in various embodiments from documents US 2012145446 A1, DE 102005036324 A1, DE 102004018434 A1 and US 5847445 A, wherein it is common for these supports that they bring additional because the initial product, such as a circuit board, has to be specially formed or later (usually before the assembly process) requires special work steps together with the corresponding auxiliary components

Method used

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  • Methods used to establish bonded connections
  • Methods used to establish bonded connections
  • Methods used to establish bonded connections

Examples

Experimental program
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Effect test

Embodiment Construction

[0047] now refer to figure 1 The problem will be explained in the case of producing a bonded connection on the example of a component 1 (for example a heat sink module) with two printed circuit boards 2 , 3 arranged on sides of the component oriented orthogonally to one another. The bonded lines, that is to say the bonding wire 4 , are produced between the electrical connections on the electronic components (in this case the circuit board) by means of known, but not shown, bonding tools. In this case, the bonding wire 4 is guided from the first connection point 5o via the surface of the component 1 to the second connection point 5u, wherein at the first connection point 5o and at the second connection point 5u the connection of the wire 4 to the corresponding Bonded connection of the contact surfaces of the joint.

[0048] In these and similar cases, the guidance of the bonding wires through the bonding tool is not feasible or simply difficult to achieve. The entire componen...

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Abstract

The invention relates to an electronic component with electrical connection points, in which at least a bonding wire is guided from at least one first connection point via a component surface to at least one second connection point, wherein at least one first connection point and at least one second connection point A bonded connection between the wire and the contact surface of the connection point is established at least at the second connection point, wherein at least one support for at least one bonding wire is provided on the component, and at the first connection point and the second connection point At least one bonding wire between is held in a predetermined distance by the support part and the surface section of the component, and the invention relates to a method for manufacturing such a component, in which method, the bonding wire Before leading from the first connection point to the second connection point, at least one support for the bonding wire is provided on the component, which supports keep the bonding wire at a predetermined distance from the surface section of the component.

Description

technical field [0001] The invention relates to a method for establishing a bonded connection (Bondverbindung) between electrical connection points on an electronic component, in which method a bonding wire is passed from a first connection point (Anschlussstelle) by means of a bonding tool The component surface is guided to a second coupling location, wherein a bonded connection of the bonding wire to the contact surface of the coupling location is established at the first coupling location and at the second coupling location, and after the bonding wire is removed from the first coupling location Prior to the introduction to the second connection point, at least one support for the bonding wire is provided on the component, said support holding the bonding wire at a predetermined distance from the surface section of the component. [0002] Likewise, the invention relates to an electronic component with electrical connection locations, wherein at least a bonding wire is guided...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/62H01L25/075
CPCH01L24/43H01L24/48H01L24/85H01L2224/0224H01L2224/02235H01L2224/43985H01L25/0753H01L33/62H01L2933/0066H01L24/45H05K1/117H05K3/222H05K3/366H01L2224/45124H01L2224/45139H01L2224/45144H01L2224/45147H05K2201/0939H05K2201/10287H05K2201/10363H01L2224/48998H01L2924/00011H01L2924/00014H01L2924/01049
Inventor E.埃的林格R.费林格B.德拉戈斯特斯
Owner ZKW GRP GMBH
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