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Heatsink and motor driving device

A radiator and heat sink technology, applied in electromechanical devices, cooling/ventilation devices, electric components, etc., can solve the problems of cost generation, unpredictable improvement of cooling performance, complex filter structure, etc., to improve cooling performance, increase Amount of fluid, effect of simple structure

Inactive Publication Date: 2018-10-09
FANUC LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In Japanese Patent Application Laid-Open No. 2010-056385, since the filter (hereinafter referred to as the filter plate) is arranged between the end of the suction side of the radiator and the fan using guide rails, there is a guide rail for positioning the filter. structure becomes complex and creates cost issues
In addition, since the cross-sectional shape of the end of the radiator is the same as the cross-sectional shape of the filter, only an amount of fluid corresponding to the cross-sectional shape of the end of the radiator can flow into the radiator, so an improvement in cooling performance cannot be expected

Method used

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  • Heatsink and motor driving device
  • Heatsink and motor driving device
  • Heatsink and motor driving device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0023] figure 1 It is an external perspective view showing the structure of the control panel 10 . figure 2 yes figure 1 Partial cross-sectional view of line II-II. Additionally, in the instructions below, follow the figure 1 Arrows shown indicate directions of front and rear, left and right, and up and down.

[0024] Inside the cabinet 16 of the control panel 10 are provided a motor driver 11 including an electronic device 12 a and a heat sink 14 for cooling the electronic device 12 a , and a mounting plate 12 on which the motor driver 11 is mounted.

[0025] The heat sink 14 has: a plurality of cooling fins 20a (refer to Figure 6A ) of the radiator main body 20; the flange portion 22 provided on the side of the radiator main body 20; When the filter plate 24 is mounted on the lower side of the radiator main body 20, it is preferable to install the filter plate 24 in such a way that the filter plate 24 is in contact with the lower end portion (hereinafter referred to a...

Deformed example 1

[0042] Figure 7 It is a perspective view showing the structure of a filter plate 24A in Modification 1. FIG. The filter plate 24A has a structure in which the air filter 50 is provided on the filter plate 24 described in the above embodiment. The air filter 50 may be provided on the fluid downstream side of the filter plate 24A (radiator body 20 side) or on the fluid upstream side of the filter plate 24A (opposite to the radiator body 20 side).

[0043] If the air filter 50 is not provided, the fluid passing through the vent 48 of the filter plate 24 contains dust or mist machining fluid, thus causing the dust or machining fluid to adhere to the radiator main body 20 and the fan 26 . However, in Modification 1, by using the filter plate 24A having the air filter 50 , it is possible to prevent dust and machining fluid from adhering to the radiator main body 20 and the fan 26 .

[0044] In addition, like the filter plate 24 of the above-mentioned embodiment, the plurality of ...

Deformed example 2

[0046] In the above-mentioned embodiment and modification 1, the fan 26 was provided on the exhaust-side end portion 21 b of the radiator main body 20 , but the fan 26 may not be provided. In this case, the opening 34 may have a size capable of inserting the radiator main body 20 and the filter plate 24 .

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PUM

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Abstract

The invention provides a heatsink (14) capable of cooling an electronic device. The heatsink includes: a heatsink main body (20) including a plurality of fins (20a); a flange portion (22) formed on the heatsink main body to install the heatsink with the electronic part mounted thereon; and a filter plate (24) detachably attached to an end portion on an inlet side of the heatsink main body, wherein: in a state where the filter plate is attached to the end portion on the inlet side of the heatsink main body, an outer shape of the filter plate is larger than an outer shape of the end portion on the inlet side of the heatsink main body on a plane perpendicular to a flow direction of a fluid in the heatsink main body; an insertion hole (38) formed in the flange portion allows the filter plate to be inserted into the filter plate from a side of the flange portion to the end portion on the inlet side of the heatsink main body; and a flange (40) formed on the filter plate at an end portion ona side opposite to a forefront end of the filter plate in an insertion direction of the filter plate into the insertion hole for positioning the filter plate with respect to the heatsink main body.

Description

technical field [0001] The invention relates to a heat sink for cooling electronic devices and a motor drive device with the heat sink. Background technique [0002] Conventionally, heat sinks have been used to cool electronic devices. However, if the radiator is used in an environment where dust or cutting fluid is scattered, dust or cutting fluid adheres to the suction side end of the radiator, causing clogging. Therefore, the flow of the fluid becomes poor, and the cooling performance decreases. [0003] Therefore, Japanese Patent Application Laid-Open No. 2010-056385 discloses a structure in which a filter is provided at the end of the radiator on the suction side, and the filter is formed to have the same cross-sectional shape as the end of the radiator on the suction side. cross-sectional shape. In addition, a structure is disclosed in which a filter is arranged between an end portion of the radiator on the suction side and a fan using a guide rail. [0004] In Jap...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20181H02K9/227H05K7/20918H05K7/20909H05K7/2039
Inventor 奥秋兼一山本和弘
Owner FANUC LTD