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Laptop cooling pad, injection molding system for producing same and injection molding process for producing same

An injection molding system, notebook technology, applied in the direction of instruments, electrical digital data processing, digital data processing parts, etc., can solve the problems of general cushioning effect, easy to slip, not soft enough, etc., to achieve good cushioning effect and adhesion. Good and productive effect

Pending Publication Date: 2018-10-12
苏州复盈新材股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The patent with the existing application number CN201210334366.3 discloses a notebook computer foot pad, which includes an integrally formed circular suction cup and a tapered foot pad located under the suction cup. The suction cup is installed close to the bottom shell of the notebook computer. The diameter of the foot pad is As the suction cup gets closer, the suction cup and the foot pad are made of rubber material, but the traditional rubber material is still not soft enough, the cushioning effect is average, the hand feeling is poor, and it is easy to slip

Method used

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  • Laptop cooling pad, injection molding system for producing same and injection molding process for producing same
  • Laptop cooling pad, injection molding system for producing same and injection molding process for producing same
  • Laptop cooling pad, injection molding system for producing same and injection molding process for producing same

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Embodiment Construction

[0035] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0036] A notebook foot pad, as shown in the figure, it includes a foot pad core 1 formed by injection molding of thermoplastics, the bottom surface of the foot pad core 1 is bonded with an LSR layer 2 for contacting the placement surface of the notebook, and the LSR layer 2 binds the foot The pad core 1 is half packed, the foot pad core 1 is installed on the bottom case of the notebook through buckles or glue, and the LSR layer 2 is in contact with the desktop and other placement surfaces. LSR layer 2 is a mixture of silica gel and vinyl and reinforcing fillers, which can be cured at high temperature, has good flexibility and excellent cushioning effect; the thickness of LSR layer 2 is between 0.2mm-0.5mm, and the thickness of LSR layer 2 is 0.2mm When it is between -0.5mm, the fluidity decreases, which is convenient for curing after setting.

[0037] Foot p...

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Abstract

The invention discloses a laptop cooling pad. The laptop cooling pad comprises a cooling pad cores formed through injection molding of thermoplastic plastic, and the bottom surfaces of the cooling padcores are bonded with LSR layers. The invention discloses an injection molding system for producing the laptop cooling pad, and the injection molding system comprises a fixed mold and a movable mold,the fixed mold is connected with a first plastic injection pipe and a second plastic injection pipe, the first plastic injection pipe is used for injecting PC, the second plastic injection pipe is used for injecting LSR, a rotating disc is rotationally arranged on the movable mold, mold cores are arranged on the rotating disc, and a driving part is arranged in the movable mold. Every time the rotating disc rotates, the movable mold moves from the first plastic injection pipe to the second plastic injection pipe, then the rotating disc rotates by 180 degrees, and the rotating disc rotates in areciprocating mode. The technical scheme of the injection molding system is characterized in that the PC and the LSR are sequentially injected by the first plastic injection pipe and the second plastic injection pipe through rotation of the rotating disc, so that the laptop cooling pad which is good in flexibility, excellent in buffering performance and excellent in anti-skid performance is formed.

Description

technical field [0001] The invention relates to the technical field of injection molds, more specifically, it relates to a notebook pad, its injection molding system and its injection molding process. Background technique [0002] Notebook pads are used to replace the bottom case of the notebook in contact with the placement surface, which can play a cushioning effect when placed, protect the notebook case from wear and reduce the noise generated when moving. [0003] The patent with the existing application number CN201210334366.3 discloses a notebook computer foot pad, which includes an integrally formed circular suction cup and a tapered foot pad located below the suction cup. The suction cup is installed close to the bottom shell of the notebook computer. The diameter of the foot pad is As it gets closer to the suction cup, the suction cup and foot pads are made of rubber material, but the traditional rubber material is still not soft enough, the cushioning effect is ave...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/16G06F1/16
CPCG06F1/1656B29C45/1628B29C45/1676B29C2045/1631
Inventor 王洪涛
Owner 苏州复盈新材股份有限公司
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