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Semiconductor refrigeration and heat dissipation device

A heat-dissipating device and semiconductor technology, applied in refrigerators, refrigeration components, refrigeration and liquefaction, etc., can solve the problems of difficult to effectively maintain the temperature in the refrigeration area, poor heat dissipation function, and difficult to disassemble and replace the cooling fins, so as to avoid refrigeration suction. Deterioration of thermal capacity, solving the effect of poor heat dissipation capacity and inconvenient replacement

Pending Publication Date: 2018-10-12
无锡艾迪尔家居有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the problems existing in the prior art that the temperature of the refrigeration area is difficult to maintain effectively, the heat dissipation function is poor, and it is difficult to disassemble and replace the cooling plate when there is a problem, the present invention provides a semiconductor refrigeration heat dissipation device, which has a simple and reasonable structural design and can be used in While controlling the temperature of the cooling area well, the heat dissipation function is greatly improved, and the cooling plate can be easily disassembled and replaced

Method used

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  • Semiconductor refrigeration and heat dissipation device
  • Semiconductor refrigeration and heat dissipation device
  • Semiconductor refrigeration and heat dissipation device

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Embodiment Construction

[0017] A semiconductor refrigeration heat dissipation device, which includes a semiconductor refrigeration block 1, the upper end of the semiconductor refrigeration block 1 is fixedly installed with a heat dissipation copper sheet 2, a heat dissipation fin 3, and a heat dissipation fan 4 in sequence, and a plurality of heat dissipation holes are evenly arranged inside the heat dissipation fin 3 31. There are at least two heat dissipation holes 31, Z-shaped mounting brackets 5 are provided on both sides of the heat dissipation copper sheet 2 and the heat dissipation fin 3, and a fixed plate 5 is installed between the bottom horizontal plate of the Z-shaped mounting frame 5 and the heat dissipation fan 4;

[0018] The lower end of the semiconductor refrigeration block 1 is fixedly equipped with a cooling copper block 6, the lower end of the cooling copper block 6 is provided with a cooling plate 7, the outer wall of the cooling plate 7 is provided with an HDEP film 71, and the HDE...

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Abstract

A semiconductor refrigeration and heat dissipation device is simple and reasonable in structural design, the heat dissipation function can be greatly improved while the temperature of the refrigeration area is well controlled, and a cold conduction sheet can be conveniently detached and replaced. The semiconductor refrigeration and heat dissipation device comprises a semiconductor refrigeration block, and a heat dissipation copper sheet, heat dissipation sheets and a heat dissipation draught fan are sequentially and fixedly arranged at the upper end of the semiconductor refrigeration block. Acold conduction copper block is fixedly arranged at the lower end of the semiconductor refrigeration block, a cold conduction sheet is arranged at the lower end of the cold conduction copper block, and the cold conduction copper block and the cold conduction sheet are in sliding connection through a sliding block and a T-shaped sliding groove in the bottom end of the sliding lock. The sliding block, a temperature detector and a temperature induction controller are fixedly arranged at the bottom end of the cold conduction copper block, and the temperature detector and the temperature inductioncontroller are located on the two sides of the sliding block correspondingly. A plurality of heat dissipation holes are evenly formed in the heat dissipation sheets.

Description

technical field [0001] The invention relates to the technical field of refrigeration and heat dissipation devices, in particular to a semiconductor refrigeration and heat dissipation device. Background technique [0002] Semiconductor refrigerators are widely used because of their fast action speed, long service life, no pollution to the environment and easy control. By adjusting the size of the working current, the cooling rate can be adjusted conveniently, and by switching the direction of the current, the refrigerator can be transformed from a cooling state to a heating working state. [0003] However, the cooling and heat dissipation function of semiconductor refrigerators commonly used in the market must be controlled within a certain range. When the temperature of the cooling area exceeds the rated range during the operation of the refrigerator, continuous cooling will cause the problem of low temperature in this area. Therefore, It is necessary to keep the temperatur...

Claims

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Application Information

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IPC IPC(8): F25B21/02F25B49/00
CPCF25B21/02F25B49/00
Inventor 席智慧
Owner 无锡艾迪尔家居有限公司
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